Join TechInsights as we teardown the Vivo X Fold3 Pro, featuring the Qualcomm Snapdragon 8 Gen 3 processor, 16 GB of RAM, and a cutting-edge camera system. Discover detailed insights into its design, battery technology, and unique features.

Renesas launched its R-Car Open Access (RoX) development platform for software-defined vehicles (SDVs). Designed for the Renesas R-Car family of system on chips (SoCs) and microcontrollers (MCUs), the aim is to speed development, reduce complexity, lower cost, and optimize deployments of next-generation vehicles.

The 2024 6.18 Online Festival in China revealed a nuanced picture of smartphone sales. Despite a 2% decline in unit sales, stable market value was maintained thanks to higher average selling prices amid a broader 3% drop in overall online sales.

Explore the innovative design and advanced features of the Vivo X Fold3 Pro, the thinnest foldable smartphone on the market. Learn about its durable carbon fiber hinge, Vivo Armor architecture, and premium aesthetics in our detailed Teardown and analysis.

In 2024, Apple launched its groundbreaking AR/VR system, the Apple Vision Pro, featuring a notable departure from conventional designs with its external battery pack.

TechInsights smartphone research team predicts global smartphone installed base will grow 2% YoY in 2024 and 2025. The growth rate will be modestly improved from 2026 through 2029 driven by technology innovations and the penetration of on-device AI smartphones. Android and Apple are expected to retain market leadership with shares of 82% and 16% in 2024, respectively.

Explore Intel's latest Coaxial Magnetic Integrated Inductor (Coax MIL) technology, enhancing voltage regulation in high-performance processors like Sapphire Rapids. Discover its impact on Intel's shift from on-motherboard to fully integrated voltage regulation and future developments in processor architecture.

Dig into this analysis of the standard cells comprising 70% of a target logic area in the the Apple A17 Pro CPU2 core, fabricated using FINFLEX methodology by TSMC in N3B process node. Standard cells schematics are extracted to determine routing efficiency, gate density, and global metal usage survey.

Discover how the AI arms race is driving advancements in high bandwidth memory (HBM) technology, with AMD, NVIDIA, Google, and Meta pushing the limits of DRAM stacking. Learn about JEDEC's updates, hybrid bonding innovations, and their impact on data center performance.