A recent earthquake in Taiwan has disrupted industries, including the data center market, raising concerns about supply chain stability.

Discover the latest advancements from industry leaders Micron, Samsung, and SK hynix, and gain insights into the future of technology.

The automotive semiconductor landscape in 2023 showcased Infineon and NXP retaining their top positions, with Infineon widening its lead over NXP.

In-car commerce (also commonly called in-vehicle payments) is one of these more recent features that OEMs have been deploying over the last several years. In-car commerce enables vehicle occupants to pay for fuel, charging, parking, and other services from the infotainment system’s display. As of early 2024, 14 automotive brands offer in-car payment features in 15 countries, with more deployments planned.

Despite facing stiff competition from Apple in the mid- to premium-tier segments, Huawei's performance during China's 11.11 online shopping festival solidified its position as a top contender.

This datasheet presents TechInsights analysis of 2023 automotive sector revenues and market shares of the leading semiconductor vendors, with revenue splits by major component product category and by region including N. America, Europe, Japan, China, South Korea and ROW. It also includes market shares and revenue splits for previous years extending back to 2010.

The Apple Vision Pro augmented reality headset uses four inferred cameras to track its wearer’s eyes. This report catalogues the structure of those camera modules, how they fit into the headset, and provides an overview of the Sony back-side illuminated CMOS image sensor that they house.

The OmniVision OX03D4C is a color, 3-megapixel (MP) resolution stacked back-illuminated (BI) CMOS image sensor (CIS) with a 1/4-inch optical format, LED flicker mitigation (LFM), and 140 dB high dynamic range (HDR) for automotive applications.

Discover the highlights of Micron's Q1 2024 report, showcasing impressive growth and strategic advancements in the semiconductor industry. Gain insights into Micron's market outlook and innovative initiatives shaping the future of semiconductors.

This is an Advanced Packaging Quick Look (APQ) summary document for the Baidu Kunlun Xin A2S1CAXGA processor, provided as a companion deliverable for the APQ-2312-801 project. The Baidu Kunlun Xin processor, also referred to as the Kunlun II, is the second-generation of the Baidu Kunlun processor series.