VALUE SHARE: Global Fitness Band Revenue and ASP by Vendor by Price Tier: Q4 2023

Global fitness band industry revenues plummeted by 44% in Q4 2023. This marks the fifteenth consecutive quarter of year-over-year (YoY) fitness band revenue declines amid macroeconomic weakness and geopolitical uncertainty. Prices have reversed course back to ASP declines due to commoditization at the low-end, and shrinking volumes at the high-end, after briefly ticking upward slightly in 2022 due to unrelenting inflation.
23Apr

System Shipments, Revenues & Feature Forecast - Q2 2024

TechInsights’ Automotive Infotainment & Telematics Q2 2024 System Market Report provides a forecast outlook for the OEM and Aftermarket hardware and feature market from 2021 through 2031. 2022 represented a year of reasonable growth which saw the OEM market opportunity for Infotainment & Telematics system vendors rising by 5.4% YoY in revenue terms.
23Apr

Semiconductor Units, Revenues & ASP Forecast - Q2 2024

TechInsights’ Automotive Infotainment & Telematics Q2 2024 Semiconductor Market Report provides a forecast outlook for OEM and aftermarket hardware and applications market from 2021 through 2031. The OEM market opportunity for Infotainment & Telematics chipset vendors increased by 13.5% YoY in revenue terms in 2023 on the back of strong vehicle production growth of over 10% YoY.
23Apr

Deep Dive Teardown of the Vivo IQOO 12 I2220 Smartphone

The Vivo IQOO 12 I2220 is the first smartphone in India to have the Snapdragon 8 Gen 3 chipset. It’s also the first device to run on a dual chip design, as the main unit is paired with a customized Supercomputing Chip Q1. This new chip is designed to boost gaming experience and allows for 144 FPS gaming. The BGA package is rather small measuring 4.3 x 3.9 mm with a die size of 3.95 x 3.6 mm manufactured by Novatek.
22Apr

Beken BK3296 22nm Bluetooth Audio SoC Process Flow Analysis

This report provides an analysis of the process flow and integration used in the manufacture of the Beken BK3296 Bluetooth Audio SoC, built using UMC's 22 nm ULP technology. UMC’s 22 nm ULP process derives from the company’s earlier 28 nm planar CMOS technology and offers up to a 10% relative area gain and better power/performance ratio with enhanced RF capability. The spreadsheet lists the hundreds of process flow steps likely used in its manufacture.
22Apr