Latest Blogs and Commentary
iPhone 16e Debuts with Apple’s First In-House 5G Modem and Enhanced AI Capabilities
Apple’s new iPhone 16e introduces the C1 modem, marking a major step toward modem independence from Qualcomm while delivering improved 5G performance and power efficiency.
Microprocessor Report January 2025 Review
Read the latest analysis on AMD’s Ryzen 7 9800X3D, Intel’s Twin Lake CPUs, and the rise of AI in edge technologies, along with key takeaways from CES 2025.
The Chip Insider®– Chiplet Integration Strategies for AI and HBM
The latest Chip Insider® blog breaks down chiplet integration strategies for AI and HBM, comparing system-down and chip-up approaches, economic impacts, and AMD's success in leveraging chiplets to gain market share.
AI GPU Growth Directly Impacts Carbon Emission Growth through 2030
Explore the forecasted impact of AI GPUs on the Carbon emission growth through 2023. Understand the factors such as HBM fueling the trend.
2025 Semiconductor Industry Forecast: Key Trends & Insights
Discover the top semiconductor trends for 2025, including AI-driven chip innovations, memory market shifts, and custom silicon advancements. View this free TechInsights report to stay ahead.
Chip Observer: February 2025
DeepSeek’s AI breakthrough shakes the market, U.S. tariffs and CHIPS Act funding uncertainty disrupt supply chains, and TechInsights uncovers major semiconductor advancements.
Intel Twin Lake budget CPUs are virtually identical twins of Alder Lake-N predecessors
Twin Lake-N is intended for low-power, budget-conscious designs, offering only single-threaded Gracemont E-cores first found in Alder Lake processors. True to the name, Twin Lake-N bears striking similarities to its Alder Lake-N predecessors.
The Chip Insider®– Can Intel be saved?
In the latest edition of The Chip Insider®, explore Pat Gelsinger’s strategy, potential Intel splits, government intervention, buyouts, and the challenges shaping its future.
DeepSeek Surpasses ChatGPT
Discover how DeepSeek’s innovative approach to AI is challenging hardware reliance and setting new benchmarks in generative AI development.
China Enters 2025 with Big Memory Breakthroughs
TechInsights reveals not one, but two advanced memory developments out of YMTC and CXMT, and their impact on the semiconductor industry.
Year in Review: AI Continues March to the Edge
See how AI progressed to the edge in 2024, with breakthroughs in edge AI chips, NPUs, and 64-bit MCUs enhancing performance and efficiency.
The Software-Defined Vehicle is Rearchitecting the Industry
Explore how software-defined vehicles (SDVs) are revolutionizing automotive technology and industry dynamics, driving centralized architectures, ADAS-cockpit convergence, and new partnerships across the value chain.
Robotaxis Outshine Traditional Automakers in the Autonomous Revolution
Learn more about how robotaxi companies like May Mobility, Waymo, and Zoox are shaping the future of autonomous vehicles in 2025, while traditional automakers take a backseat.
The Chip Insider®– China’s IC Market Flooding
Examine the impact of mature node chip overcapacity, price collapses, and global market implications. Learn how this shapes the semiconductor industry.
Microprocessor Report December 2024 Review
Dive into the latest Microprocessor Report highlights: MediaTek Dimensity 9400 analysis, NPU advancements for edge IoT, Intel CEO Pat Gelsinger's retirement, and key takeaways from the 70th IEEE IEDM event.
TechInsights’ Analysis of AMD’s MI300X Reveals Samsung HBM3
TechInsights reveals the first commercial use of Samsung's HBM3 memory in AMD’s MI300X AI accelerator. Discover how this breakthrough impacts AI processors, memory technology, and advanced packaging.
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