The external aspect of the device is crafted from aluminum, serving as the primary component of its thermal design. This housing functions as the primary heat dissipater, absorbing and dispersing heat generated from within the device. The primary heat-producing integrated circuits (ICs) are covered with TIM (thermal interface material), establishing a connection with the housing, and facilitating the transfer of heat to ensure effective heat dissipation.

The YMTC 1 Tb 232L quad-level-cell (QLC) 3D NAND flash memory device is packaged inside the YMTC YMN0AQF1B1HCAD NAND flash memory package, which was found on the ZhiTai Ti600 M.2 PCIe 4.0 NVMe 1 TB solid state drive (SSD). This Internal Waveform Overview (IWO) analysis provides an overview of the internal voltages required to program, read, and erase the flash memory cells.

The overall telecom equipment market has slowed down in 2023 after few years of consistent growth. Global 2023 telecom equipment revenues have a -5% decline from 2022. As in the past, the total market is highly concentrated among the top few players, in 2023, the top 4 vendors accounted for almost 70% of the global market in 2023.

TechInsights has updated its Automotive Electronics Design Center Database, where research and development of automotive electronics systems and components are undertaken by the world’s leading Tier 1 vendors. This database lists 13 new entries and new facilities, and 18 updated existing entries, which also includes centers developing technology in automotive communication, infotainment, telematics and electric vehicle batteries. In total, around 2,500 centers are listed.

Global 5G handset industry revenues and shipments grew double digits in Q4 2023. Apple remains the leader of 5G shipments and revenues, but Samsung is growing behind Apple. Samsung is the world’s second-largest 5G vendor in terms of shipments and revenues. Samsung is the biggest vendor in LTE shipments and revenues.

The Toshiba TH58LKT2V46BA8S TLC 3D NAND flash is a 154-ball grid array (BGA), multi-chip package (MCP), measuring 13.5 mm × 11.5 mm × 0.9 mm thick, including solder balls. The TH58LKT2V46BA8S contains eight stacked KIOXIA 162-layer FXZ5 512G dies, arranged in two side by side four die stacks. Bond wires connect the two die stacks to the two wider sides of the printed wiring board (PWB).

The Samsung Galaxy S24+ is one of Samsung’s flagship S series phones launched at the Galaxy Unpacked event on February 17, 2024. The SM-S926N model is targeted at the Korean market. In the Samsung Galaxy S24+ SM-S926N phone, Samsung provided 15 out of 42 packages in design wins.

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The Inner Workings: Analyzing Lithium-ion Coin Batteries in AirPods Pro 2 and Huawei Watch Buds Uncover the secrets behind the lithium-ion batteries in Apple AirPods Pro (Gen. 2) and Huawei Watch Buds. Learn how cathode composition influences energy density and performance in compact wearables