Launched in 2021 by the Chinese electric vehicle startup Leapmotor, the Leapmotor C11, is equipped with an array of advanced driver assistance systems (ADAS). Utilizing computer vision, radar, and diverse sensors, these ADAS features enhance safety and comfort for the driver.

The basic slate is still a favorite device for casual, lean-back activities such as watching videos, gaming, and social media; Detachable 2-in-1s have evolved into high performance PC replacements as versatility and mobility serves enterprise demand, prosumer demand, and now broader appeal to consumers with affordable, powerful Android and iPadOS options.

Global Fitness Band shipments plummeted by over 40% YoY for the second consecutive quarter during Q3 2023. Slumping demand for the market leading Xiaomi Mi Band line as well as a market exit from Samsung, in addition to macroeconomic weakness, geopolitical uncertainty, and continued high inflation stifling consumer discretionary spending contributed to the downtick.

The Blink Wired Floodlight Camera runs on the Immedia Semi SoC. Infineon’s CYW43438 is responsible for wireless communication through the WiFi/BT antenna. WiFi/BT SoC is supported by 32 MB Flash memory from Windbond.

This is a package analysis (PKG) of the VisionIC VI5300A1 direct time of flight (dToF) sensor from the Huawei Mate 60 Pro smartphone. The dToF sensor consists of a VCSEL emitter and a single-photon avalanche diode (SPAD) sensor. This package analysis report examines the composition of the dToF sensor, including its lenses, filters, emitter, and SPAD sensor.

Smartphone sales posted double-digit annual decline during China’s 11.11 online festive this year, blaming the mixed demand and the competition from other online sales. However, sales of higher-end models were robust and foldable and gaming segments registered growth.

This report provides a Synopsys 3D-emulation analysis of the process flow and integration used in the manufacture of the NVH4L022N120M3S SiC die from onsemi M3S family. The emulation includes SPX output files that can be used as input into other Synopsys models.

The 2023-H2 update of the OECD Bundled Communication Price Benchmarking service is now available for download.

This report presents a Memory Process Flow Analysis on the futuristic SK hynix 321-Layer NAND, which is scheduled for mass production from the first half of 2025.

This report presents key DC electrical characteristics for logic NMOS and PMOS transistors located in the CPU1 region of the HiSilicon Kirin 9000s, Hi36A0 GFCV120 application processor die. The HiSilicon Kirin 9000s application processor was extracted from the Huawei Mate60 Pro Smartphone.