Toshiba TH58LKT3V46BA8S 162L 1Tb TLC 3D NAND Memory Floorplan Analysis

The KIOXIA/Western Digital 162-Layer (BiCS6) 3D NAND was developed in 2021. Significant differences with 112-Layer technology include lateral scaling advancement and circuit under array CMOS placement. This report presents a Memory Floorplan Analysis of the KIOXIA FXZ0_1T die found inside the Toshiba TH58LKT3V46BA8S package. The TH58LKT3V46BA8S was extracted from the DapuStor HaiShen5 7.68 TB H5100 SSD.
20Dec

Survey Plus Teardown of the Samsung Galaxy A05s SM-A057F/DS Smartphone

The Samsung Galaxy A05s SM-A057F saved on the Application/Baseband processor, using the Snapdragon 680, which is over $47 less than other application/baseband processors on average. Even though this is a Survey Plus Teardown, which does not include mechanical costs for the phone or the subsystem, it is unlikely the Galaxy A05s total subsystem prices exceed $146 to match the average total price of other mobile phones.
20Dec

Samsung K9DYGY8J5B-CCK0 236-Layers 3D NAND Flash Memory Floorplan Analysis

Ten months after Samsung’s 236-Layer (V8) TLC Vertical NAND (V-NAND) mass production milestone in November 2022, the 4 TB SSD 990 PRO is announced, in September 2023. This report presents a Memory Floorplan Analysis of the Samsung K9AKGD8J0B die found inside the Samsung K9DYGY8J5B-CCK0 package. The K9DYGY8J5B-CCK0 was extracted from the Samsung MZ-V9P4T0 990 PRO 4 TB SSD.
20Dec

Deep Dive Teardown of the Kioxia XD6 KXD6CRJJ3T84 SSD

The memory: non-volatile, logic, substrates and memory: volatile category had the greatest impact on the total estimated constructions cost. The cost of each category consists of: -memory: non-volatile ($190.74 –8x 512 GB 3D TLC NAND Flash), -logic ($12.04 –NVMeSSD controller), -substrates ($5.29 –main board), -memory: volatile ($6.54 –2 GB LPDDR4 SDRAM).
19Dec