Silicon Valley startup D-Matrix is trying to accelerate LLMs with its digital in-memory compute (DIMC) chip. The company’s Corsair card provides up to 9,600 TOPS at 600 W.

Qualcomm’s new Snapdragon X Elite for laptops finally achieves competitive Arm-architecture performance while keeping power low. It’s the company’s first use of its Nuvia-originated CPU.

Qualcomm’s Snapdragon 8 Gen 3 uses more, faster CPUs and fewer power-efficient CPUs to boost performance. The company’s glitzy AI demos highlight’s what’s now possible on a phone.

AI-chip startups raised billions of dollars in prior years, but this year investors turned their attention to RISC-V startups. The new instruction set faces both technical and business challenges.

This is a Digital Floorplan Analysis (DFR) of the AMD DGX3D cache die found inside the AMD Ryzen 9 7950X3D desktop processor component.

The Huawei Mate 60 Pro is powered by Octa-Core HiSilicon Kirin 9000S Octa-Core Applications/Baseband Processor. For more information about the processor please look at the Digital Floorplan Analysis (DFR-2309-801) report.

This report provides an analysis of the standard cells comprising about 70% of the area analyzed in the logic block of the MediaTek 4nm Dimensity 9200 X3 CPU.

This is a Memory Floorplan Analysis (MFR) of the the Micron Technology LPDDR5 Y52P die with a memory capacity of 16 Gb and D1β nm generation node.

Global 5G smartphone wholesale revenues will surge between 2019 and 2028. It is by far the fastest-growing sector of the smartphone industry for the next decade.

We expect mmWave technology to reach 10% penetration of all 5G smartphones in 2023. The majority of sales volumes come from the North American market.