Samsung Galaxy Watch 7
Discover the Samsung Galaxy Watch 7 with TechInsights. Explore the latest Exynos W1000 processor, advanced health tracking, AI wellness tools, and our detailed technical analysis.
Samsung Exynos W1000 Processor
Get an in-depth first look at the Samsung Exynos W1000 processor in the Galaxy Watch 7 Series. Discover the 3nm gate-all-around process, critical dimensions, and upcoming detailed analyses on TechInsights.
Huawei
Ren Zhengfei (任正非) founded Huawei in 1987 and continues to lead as CEO. Three other executives—Guo Ping (郭平), Eric Xu (徐直军), and Ken Hu (胡厚崑)—run its three main business units and manage day-to-day operations under Ren. Huawei, one of the world’s leading communications equipment suppliers, has suffered under US sanctions that cut off its access to advanced foundry services.
AMD
AMD’s latest data center GPU product, MI300X, is comparable to Nvidia’s H100 and could potentially grab market share from Nvidia in the red-hot AI market. AMD is on to its third generation of data center AI chip products. Its ROCm software stack has made significant progress in recent years, although it is yet to meet the maturity of Nvidia’s software stack.
Ambient Scientific
Ambient Scientific is a Silicon Valley startup that has developed a new AI processor based on analog-circuit techniques. CEO Gajendra Singh, previously VP of Engineering at Wave Computing, launched the company in 2017. It remained in stealth mode until its 2019 announcement of the GPX-10, which followed the close of its $17 million Series A funding.
Taking Monolithic Designs to Disaggregation
The term ‘chiplet’ has come into use to describe an evolved design strategy moving past monolithic system-on-chip (SoC) to the heterogeneous integration of a disaggregated design in a system-in-package (SiP).
Chiplet Technology: Disrupting Chip Design and Fueling Growth
The semiconductor industry is facing a turning point with the rise of chiplet technology (also known as chiplet-based design or semiconductor chiplet technology). This revolutionary approach has been made possible by the advances in chip-to-chip interconnect and is poised to reshape chip production and design, particularly within the computing segment.
Apple R1 Adopts TSMC’s Latest Package
Apple’s R1 sensor hub chip in the Vision Pro AR/VR headset is the first use that TechInsights has seen of TSMC’s InFOM advanced packaging technology. The R1 has a 5nm processor chip plus two LLW DRAMs linked by short very-high-density interconnect to speed up the data processing.
LiDAR Technology in Apple Vision Pro
Spatial computing is a highlight of the new Apple Vision Pro headset. This device uses various sensors to integrate virtual and physical environments by sensing the three-dimensional structure of the user's space and eye movements.
The Chip Observer (June Edition)
Dive into the latest Chip Observer for June 2024! Explore major advancements in AI PCs, competitive shifts in datacenter GPUs, and insights on the recovering memory market. Discover how NVIDIA’s dominance is being challenged and get the scoop on IBM’s strategic moves.