Disruptive Event - MediaTek’s Dimensity 1050 chipset AiP

Following up on MediaTek’s strong entry into the 5G mmWave market with their Dimensity 1050 chipset, TechInsights has discovered an innovative mmWave antenna array design in their MT6107O antenna-in-package (AiP) as used in the Moto Edge 2022, model XT2205-3 (Verizon edition), and not previously seen in AiP designs from Qualcomm, Murata, and Apple.
20Mar

Sustainability Panel at SPIE ALP

Sustainability Panel at SPIE ALP G. Dan Hutcheson The Chip Insider® Sustainability Panel at SPIE ALP: Why me? Which was my first question when they asked me to run this panel. As you know, until recently, I have considered sustainability to be a “boy scout” issue: something nice to do, but unlikely
17Mar

Webinar: Minimizing Battery Degradation in Smartphones

This webinar reviews the existing industry fast charging techniques used by Apple, Samsung, and Xiaomi in their recent flagship smartphones. It was observed that these smartphones benefit from adaptive charging algorithms to suppress battery degradation, which would generally result from the high applied current.
14Mar

Chiplet Technology Advances

Packaging technology goes hand in hand with chiplets. Examples include basic PCB-based 2D structures, passive silicon interposers and bridges for 2.5D packages, 3D packages employing active interposers, and hybrid bonding.
13Mar

Generative AI on a Phone?

Generative-AI models such as ChatGPT are typically large and run only in the cloud, but Qualcomm recently demonstrated a smaller image-generation model called Stable Diffusion performing inference on a smartphone.
13Mar

Ceva XC20 Enables Vector-Unit Sharing

The new Ceva XC20 architecture implements simultaneous multithreading in a vector DSP. The first product to use it, the XC22 more than doubles area efficiency compared with Ceva’s previous DSP cores.
13Mar