Octeon 10 Fusion combines Arm Neoverse N2 CPUs, packet-processing hardware, DSPs, and in-line wireless accelerators. Targeting 5G infrastructure, it’s the only merchant-market integrated base-station processor for macrocells.

Are you finding the SoC and ASIC design challenging and time? It takes tremendous time and effort to build up knowledge of the industry, your competitors, your target market, and the product strategies of various SoCs. You may also need to understand critical competitive product benchmarks to achieve design efficiency and differentiation and to enhance your product's performance while optimizing for cost.

Rising macro uncertainties are impeding the prospects of 2H23 recovery Andrea Lati Order activity for semiconductor equipment remained steady at 45°. Both chipmakers and equipment suppliers are exercising caution regarding their near-term prospects, as demand trends are still predominantly negative

Following up on MediaTek’s strong entry into the 5G mmWave market with their Dimensity 1050 chipset, TechInsights has discovered an innovative mmWave antenna array design in their MT6107O antenna-in-package (AiP) as used in the Moto Edge 2022, model XT2205-3 (Verizon edition), and not previously seen in AiP designs from Qualcomm, Murata, and Apple.

Grab your jackets! It's going to be a cold Spring! (March Update) Shereen Vaux Order activity for semiconductor equipment slipped to a chilly 45°. There were some notable changes made to our forecasts this month. The February data are in from the Taiwanese companies, and it is clear sales are

Sustainability Panel at SPIE ALP G. Dan Hutcheson The Chip Insider® Sustainability Panel at SPIE ALP: Why me? Which was my first question when they asked me to run this panel. As you know, until recently, I have considered sustainability to be a “boy scout” issue: something nice to do, but unlikely

TechInsights' Semiconductor Analytics report

This webinar reviews the existing industry fast charging techniques used by Apple, Samsung, and Xiaomi in their recent flagship smartphones. It was observed that these smartphones benefit from adaptive charging algorithms to suppress battery degradation, which would generally result from the high applied current.

Packaging technology goes hand in hand with chiplets. Examples include basic PCB-based 2D structures, passive silicon interposers and bridges for 2.5D packages, 3D packages employing active interposers, and hybrid bonding.

Generative-AI models such as ChatGPT are typically large and run only in the cloud, but Qualcomm recently demonstrated a smaller image-generation model called Stable Diffusion performing inference on a smartphone.