Teardown: Samsung Galaxy Z Fold 5G Foldable phones, once thought to be a dream, have become a reality. While flip phones were introduced many years ago as one of the first iterations of expanding cell phone form factors, it wasn’t the screen that folded but more the phone housing and keyboard

TechInsights' Semiconductor Analytics Report

Teardown: Lenovo ThinkPad X1 Fold laptop Foldable electronics are growing in number but remain a niche market overall. Consumers are interested in the technology but the practicality of using foldable electronics is something that just hasn’t caught on in waves. While foldable smartphones have been

In this webinar, Dr. Stephen Russell will delve into the innovations found within recently released GaN devices for both low-voltage ( 600 V) devices aimed at data centers and high voltage (>650 V) devices looking to enter the light industrial and even automotive markets.

RISC-V International, the governing body of the open-standard instruction set, recently approved four new specifications that address multiplication, bootloaders, and debugging, reducing the gap with Arm.

Imagination Technologies has unveiled its first Catapult family member. Based on the RISC-V architecture, the CPU core targets real-time applications, putting Cortex-R52 in its sights.

In the latest round of MLPerf Training results, Graphcore’s Bow offers a modest improvement and Habana’s Gaudi2 triples performance over its predecessor, vaulting past Nvidia’s A100 on one benchmark.

Micron, and now other leading 3D NAND players such as Samsung, SK hynix, KIOIXA, and Western Digital (WD) have finished the risky product stage and just moved onto the high-volume product stage with a higher yield for SSD application. Dr. Jeongdong Choe compares each.

TechInsights' Semiconductor Analytics Report

New Intel Atom processors have 4 to 24 CPUs and target enterprise networking and SMB storage. They extend the Snow Ridge product line and largely replace the Denverton family.