Meta has developed an AI accelerator chip called MTIA, following in the footsteps of Google and Amazon. Employing RISC V CPUs and fixed-function units, the chip offered 102 INT8 TOPS at 25 W TDP.

Lightelligence’s ONoc interposer connects chiplets optically through silicon waveguides on a monolithic multireticle substrate. The company launched a machine-learning application as a demonstrator.

The MLPerf benchmark added tests to assess GPT-training performance. AI processors from Nvidia and Intel (Habana) both exhibit good scaling.

The Harman 4D DSS Booster is a part of Bowers & Wilkins 4D Diamond Surround Sound used in BWM iX vehicles.

This report presents a device essentials (DEF) of the STMicroelectronics VB56G4A 1.5 MP resolution, 2.61 μm pixel pitch, stacked back-illuminated monochrome CMOS image sensor for automotive applications.

Compared to Samsung's A32 5G and A42 5G, the A34 5G has an entirely different RF design even though some ICs are the same.

This report presents a process analysis (AFF) of the Taiyo Yuden FSFCSR1T2G44EG66 Film Bulk Acoustic Wave Resonator (FBAR) Filter, extracted from the Honor 70 5G smartphone.

TechInsights recently conducted a comparison between the camera systems of two prominent flagship smartphones: the Apple iPhone 14 Pro Max and the Samsung Galaxy S23 Ultra. Explore the image sensor components featured in these two leading flagship smartphones in the TechInsights Platform.

TechInsights has identified Samsung's revolutionary 3nm gate-all-around (GAA) process within the Whatsminer M56S++ crypto-mining ASIC from Chinese manufacturer MicroBT.

This database has collated the various developers and suppliers of known OEM- and dealer-fitted Passive Entry Go, Passive Go and long range two-way communication systems, listed by vehicle model assembled since 1999 and by known future models.