This TechInsights data model presents a view of the East Europe outlook for xEV systems and associated semiconductor and sensor demand. Despite the uncertainties and challenges posed by the Ukraine conflict, semiconductor shortages, and a slowing domestic and global economy, the push towards electrification and battery electric vehicles in particular is not slowing down with volume demand continuing to grow.

This TechInsights data model presents a view of the China outlook for xEV systems and associated semiconductor and sensor demand. Despite the uncertainties and challenges posed by the Ukraine conflict, semiconductor shortages, and a slowing domestic and global economy, the push towards electrification and battery electric vehicles in particular is not slowing down with volume demand continuing to grow.

This TechInsights data model presents a view of the Brazil outlook for xEV systems and associated semiconductor and sensor demand. The market remains at an early stage with a primary emphasis towards hybrid platforms. Deployment of battery electric vehicles remains at an early stage with combined volumes still expected to be lower than for hybrid platforms.

This TechInsights data model presents a view of the Global outlook for xEV systems and associated semiconductor and sensor demand. Despite the uncertainties and challenges posed by the Ukraine conflict, semiconductor shortages, and a slowing domestic and global economy, the push towards electrification and battery electric vehicles, in particular, is not slowing down with volume demand continuing to grow.

This report presents a power essentials analysis of the Infineon CYPD7271-68LQXQ that belongs to the CCG7DC family of highly integrated dual-port USB-C power delivery solutions with integrated buck-boost controllers. Near the logic region, two memory blocks, potentially ROM or SRAM, are identified. Additionally, an extra flash memory block is observed, utilizing Infineon's embedded nonvolatile memory technology.

Hear the analysts reflect on the accuracy of their predictions, their most surprising discoveries, and the implications of all the groundbreaking announcements for the upcoming year. 

This TechInsights data forecast provides the latest metrics identifying the size and growth rate of the future semiconductor demand totals across the Powertrain, Body, Chassis, Safety, and Driver Information application domains for the main light vehicle producing regions: North America, Japan, Europe, Russia, South Korea, China, India, Brazil, Thailand, and rest of the world.

Samsung has the most design wins for the Samsung Galaxy S23 FE with twelve major ICs. Samsung provided the Octa-Core Applications/Baseband Processor developed with 5 nm CMOS technology.

In our full report on computing at CES, we explore the different approaches to AI by industry players, the real-world implications of AI, and other computing products and solutions that surprised us by their presence or lack thereof at the show.

MediaTek has provided thirteen chips for the Vivo X100 V2309A. It supplied the Dimensity9300 Applications/Baseband Processor, Power Management and Audio CODEC, 6x Power Management, RF Transceiver, WiFi7/Bluetooth SoC, 2x Envelope Power Tracker, and GPS Receiver.