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Consumer Electronics Video Series Part 4: Post-Show Reflections Unpacking CES® 2024 Join TechInsights Director of Consumer Electronics Research, David Watkins, and the leading analysts who attended CES® 2024, as they reflect on the accuracy of their pre-CES predictions, share surprising discoveries

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TechInsights Consumer Electronics Leverage unrivaled technical insights about the continuous cycle of innovation in the semiconductor market to benchmark chip design against competitors. Platform Member? Sign In Start your free trial Your Consumer Electronics Solutions Through TechInsights, Platform

CES 2024 brought some 130K visitors and more than 4,000 exhibitors to Las Vegas, being the world’s largest audited in-person tech event. “AI for All” was the main theme of the show this year, with on-device AI or AI on the (network) edge being a specific focus area especially for chip vendors and mobile device manufacturers. In this report, we focus mainly on the wearable devices and XR headsets and applications showcased at the event.

The third generation from 2023 -Amazon Echo Show 5 H97N6S, just like its first version from 2019 - Amazon Echo Show 5 H23K37 provides smart display solutions suitable for home and office applications. Both devices were equipped with 5.5-inc TFT-LCD Display with Touchscreen of 960x480 pixels resolution with capacitive touchscreen.

Several manufacturers share design wins in the Bosch Multi-Purpose Camera 3 Camera. Renesas' R-Car V3H SoC, supported by a 32-bit microcontroller powers the core processing. RAM memory was provided by Samsung.

This is a Basic Floorplan Analysis (BFR) of the Broadcom BCM6717 RF transceiver die found inside Broadcom BCM67263 and BCM6726 components. Both Broadcom BCM67263 and BCM6726 components are 4x4 IEEE 802.11be Wi-Fi 7 MAC/PHY/radio system-on-a-chip (SoC) devices with Multi-Link Operation (MLO) in addition to multi-user technologies such as OFDMA (downlink and uplink) and MU-MIMO (downlink and uplink).

The S111341A high-band/mid-band front end module was found in Huawei's Mate 60 Pro mobile handset, which also features SMIC’s first 7nm device. The module contains eight active dies and 65 other passive devices.

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