Survey Plus Teardown of the Vivo X100 V2309A Smartphone
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MediaTek has provided thirteen chips for the Vivo X100 V2309A. It supplied the Dimensity9300 Applications/Baseband Processor, Power Management and Audio CODEC, 6x Power Management, RF Transceiver, WiFi7/Bluetooth SoC, 2x Envelope Power Tracker, and GPS Receiver. The Vivo X100 has five sensors, these are 3-Axis Electronic Compass, 6-Axis MEMS Gyroscope and Accelerometer, Ambient Light Sensor, Capacitive Proximity Controller, and ToF Proximity Sensor.
The RF design is based on three front-end modules from Qorvo, one RxD front-end module from Maxscend, five switches from Maxscend, Sony and Murata, and a few small modules. The applications/baseband processor, camera / image category had the greatest impact on the total estimated constructions cost. The cost of each category consists of applications/baseband processor ($138.48 –MediaTek Dimensity9300), camera / image ($17.59 –50 MP BSI CMOS Image Sensor, $9.95 –64 MP BSI CMOS Image Sensor, $7.57 –32 MP BSI CMOS Image Sensor, $7.19 –50 MP BSI CMOS Image Sensor, $4.35 –Image Signal Processor). The manufacturer with the main cost is MediaTek. It supplied the Dimensity9300 Applications/Baseband Processor, Power Management & Audio CODEC, 6x Power Management, RF Transceiver, WiFi7/Bluetooth SoC, 2x Envelope Power Tracker, GPS Receiver. MediaTek supplied a total of 13 chips for this device.
