This Excel spreadsheet contains forecasts for the installed base, value, and shipments of public cloud processors, accelerators, and memory for the next five years. Cloud providers will face a growing need for processors to keep up with the increasing demand for computational power.

Prior to the latest Marvell Analyst Summit, the company reported financial results showing significant growth in its enterprise data center business driven by demand for artificial intelligence and cloud-based applications.

Automotive semiconductor and sensors market shares for nine device types. The data covers 2015 to 2022 and also 21 suppliers by device type.

Global 5G smartphone shipments growth will remain low in 2023 due to economic turbulence. Growth is stagnating due to Chinese softness and geopolitical and economic turbulence. Apple leads vendors with nearly a one third share of all 5G shipments globally, followed by Samsung and Xiaomi.

This report provides an analysis of the floorplan design used in the Innovium TERALYNX 7 Data Center Ethernet Switch and includes an executive summary and supporting image sets SEM cross sectional and bevel imaging sets.

Explore the dynamic landscape of the global smartphone market in 2023, where Samsung leads in market share, followed by Apple, and Xiaomi securing the third spot. Discover industry insights, including Transsion's impressive double-digit growth rate, in this comprehensive report.

History and forecast for automotive semiconductors and sensors demand. Includes data from 2015 to 2030 by domain and device type. Also incudes an xEV powertrain semiconductor demand forecast.

Last year, the public cloud delivered a colossal 3.9 trillion virtual CPU-hours of computing power, equivalent to a single processor hyperthread operating around the clock for 445 million years. Cloud providers used a minimum of 7.5 million processors to deliver this capability, with a market value of $39 billion, according to TechInsights’ Cloud and Datacenter coverage area.

This is a Memory Floorplan Analysis (MFR) of the Winbond LPDDR3 SIRIUS D2D3 die with a memory capacity of 1 Gb and a 25 nm generation node. The memory arrays with array peripheral takes about 52% of the die area.

This report provides an analysis of the process flow and integration used in the manufacture of Solidigm 192L QLC 3D NAND Flash.