Q4 2023 saw average lead times continue to fall for all automotive semiconductor components. Eight product segments have lead times at pre-pandemic levels under 16 weeks. Only five product segments still have lead times over 16 weeks.

The Huawei Freebuds 3 Pro are wireless binaural stereo earphones. It supports wireless charging, up to 2 W. Battery of charging case has 510 mAhof capacity, and earbuds feature 55 mAh each.

The TP-LINK Wireless Visual Cat Eye #TL-DB635A is a smart video home doorbell. Using WiFi connectivity, it is capable of streaming audio and video. The producer used a 180-degree field of view through the design of the lens that tilts down.

Discover the technological strides of Huawei with TechInsights in our deep dive. From the Mate 60 Pro to the Huawei Qingyun L540 laptop, explore groundbreaking devices and pivotal events shaping China's tech landscape.

Global annual handset shipments showed positive growth, the first in ten quarters, in Q4 2023. Global 5G smartphone shipments showed positive growth, while 4G LTE, 3G and 2G shrank. Apple captured the top spot in 5G while Samsung leads in overall global handset shipments.

Start-up funding and mergers and acquisitions (M&A) activity slowed during the quarter with higher interest rates and regulatory hurdles. A higher than usual proportion of announcements centered on new fab construction and new process technologies including very high frequency acoustic filters, 2 nm complementary metal-oxide-semiconductor (CMOS), and silicon carbide power. Wi-Fi 7, gallium nitride, and non-terrestrial networks were hot topics.

The user experience (UX) of digital assistants was a focus at CES 2024, where various OEMs and suppliers including Mercedes, BMW, Volkswagen, Cerence, TomTom, and Qualcomm presented generative artificial intelligence (AI) digital assistants.

TechInsights analysts Gina Luk, Director of Telecom Strategies, and Waseem Haider, Principal Analyst in IoT & Enterprise Research, are set to unravel the compelling topics poised to take center stage at MWC 2024.

This report contains the results of the process analysis of the Skyworks temperature compensated surface acoustic wave resonator (TC-SAW) filter die from the Skyworks SKY50313 RF front-end (RFFE) module.

This report presents an Advanced Floorplan Analysis of the ISP die from the OmniVision OX03D4C, 1/4” format, 3.0 MP resolution, 2.1 μm pixel pitch, stacked back-illuminated CMOS Image sensor for automotive applications. This die features a stacked system on chip (SoC) image sensor with HDR, LFM capability and RCCB CFA, 140dB, low power consumption below 500 mW.