Renesas R7F702301BEBBA-C_BC6 TSMC 28nm Embedded Flash Advanced Memory Essentials

This report provides insight on the structure and materials used in the manufacture of the Renesas R7F702301BEBBA-C_BC6 microcontroller comprising a die fabricated using TSMC 28 nm HPL HKMG CMOS process with embedded flash (eFlasH). The report includes a summary of key findings, and a detailed look at the eFlash array and peripheral structures and materials used. SEM, TEM and materials analysis provide a complete look at how this device was manufactured.
01Feb

Deep Dive Teardown of the Samsung Galaxy A05 SM-A055F/DS Smartphone

MediaTek and Lansus have the most design wins for the Samsung Galaxy A05. The Application/Baseband Processor and power management with audio CODEC were from MediaTek. MediaTek (MT6769V/CZ) Octa-Core Helio G85 Applications/Baseband Processor also is used in another budget smartphones for the Asia market, like Vivo Y27 (V2249) and Xiaomi Redmi 12 (23053RN02A).
31Jan

Automotive Semiconductor TAM by Sector by Domain

This market forecast report shows that Economy Vehicles are now the fastest growing vehicle sector for automotive semiconductor demand, with a dollar CAAGR of 12% expected over 2023 to 2028. This report now also includes data for semiconductor sensors.
31Jan

Automotive Semiconductor TAM by OEM Group by Domain

This market forecast report shows that Jianghuai Automotive is expected to be the fastest growing vehicle OEM for automotive semiconductor demand, with a dollar CAAGR of 18% expected over 2023 to 2028. This update has added in unit data alongside the existing dollar data. It also now includes data for semiconductor sensors.
31Jan