The global tablet applications processor (AP) market remained flat growth year-on-year in terms of revenue in Q3 2023. Apple iPad Apps Processor commands a 69% market share of overall tablet Apps Processor revneue. x86-based APs, driven by Intel, dropped to 8 percent unit share as tablet PC sales stalls. This report tracks stand-alone and integrated tablet applications processor unit shipments, revenue market share and ASPs for 24 tablet apps processor chip vendors on a quarterly basis, and includes provisional estimates up to Q3 2024.

This market forecast for automotive sensors in light-duty vehicles shows that the packaged sensor market is now expected to grow at a CAAGR of 3.7% over 2023 to 2028. This is above the expected vehicle production growth of 1.5%, showing rising sensor content per vehicle. Sensor types covered in this forecast include speed, position, temperature, accelerometer, pressure and gas sensors.

资本设备 利用对半导体市场创新持续周期独树一帜的技术见解，对竞争对手的芯片设计进行对标测试。 平台用户？登录 开始您的免费试用 您的资本设备解决方案 TechInsights平台用户有机会在一个地方订阅资本设备解决方案和多个附加服务。 电池 图像传感器 物联网连接SoC 逻辑 制造设备 存储 移动RF 功率 半导体执行洞察 附加解决方案 附加解决方案提供补充的特性和功能，增强TechInsights产品或服务的核心功能。 半导体制造经济 半导体增长领域的供应关系和活动数据库，以及汽车和消费电子市场芯片的详细数量预测。 BOM数据库和子系统的BOM数据库

The future of personal service robots is an exciting and rapidly evolving field that holds significant potential for both consumers and businesses. As technology continues to advance, personal service robots are poised to become increasingly sophisticated, functional, and accessible.

The 32 MP front camera on the Xiaomi 14 23127PN0CC uses an OmniVision’s image sensor. Three back cameras are also included. The primary 50 MP wide-angle has an integrated OIS and AF module and a OmniVision image sensor.

Apple AirPods Pro 2nd Generation, as an important product manufactured by Apple, is powered by NMC-based cathode Li ion batteries, generating 49 mAh capacity (per earbud). The BEF includes a summary of observed device metrics and salient features with supporting images and data.

This report provides insight on the structure and materials used in the manufacture of the Renesas R7F702301BEBBA-C_BC6 microcontroller comprising a die fabricated using TSMC 28 nm HPL HKMG CMOS process with embedded flash (eFlasH). The report includes a summary of key findings, and a detailed look at the eFlash array and peripheral structures and materials used. SEM, TEM and materials analysis provide a complete look at how this device was manufactured.

The SK Hynix’s Hi-5022Q is a color, 1/2.8” optical format, high quality 50 MP stacked back-illuminated CMOS image sensor (CIS) with a 0.64 μm pixel pitch for mobile phone camera applications. This CIS was extracted from the 8849 TANK 3 phone rear/front-facing camera.

MediaTek and Lansus have the most design wins for the Samsung Galaxy A05. The Application/Baseband Processor and power management with audio CODEC were from MediaTek. MediaTek (MT6769V/CZ) Octa-Core Helio G85 Applications/Baseband Processor also is used in another budget smartphones for the Asia market, like Vivo Y27 (V2249) and Xiaomi Redmi 12 (23053RN02A).