Start-up funding and mergers and acquisitions (M&A) activity slowed during the quarter with higher interest rates and regulatory hurdles. A higher than usual proportion of announcements centered on new fab construction and new process technologies including very high frequency acoustic filters, 2 nm complementary metal-oxide-semiconductor (CMOS), and silicon carbide power. Wi-Fi 7, gallium nitride, and non-terrestrial networks were hot topics.

The user experience (UX) of digital assistants was a focus at CES 2024, where various OEMs and suppliers including Mercedes, BMW, Volkswagen, Cerence, TomTom, and Qualcomm presented generative artificial intelligence (AI) digital assistants.

TechInsights analysts Gina Luk, Director of Telecom Strategies, and Waseem Haider, Principal Analyst in IoT & Enterprise Research, are set to unravel the compelling topics poised to take center stage at MWC 2024.

This report contains the results of the process analysis of the Skyworks temperature compensated surface acoustic wave resonator (TC-SAW) filter die from the Skyworks SKY50313 RF front-end (RFFE) module.

This report presents an Advanced Floorplan Analysis of the ISP die from the OmniVision OX03D4C, 1/4” format, 3.0 MP resolution, 2.1 μm pixel pitch, stacked back-illuminated CMOS Image sensor for automotive applications. This die features a stacked system on chip (SoC) image sensor with HDR, LFM capability and RCCB CFA, 140dB, low power consumption below 500 mW.

This device essentials folder (DEF) presents the Samsung S5KHM5SX 1/2.55”, 48 MP, 0.70 µm Pixel Pitch, Stacked Back-Illuminated, ISOCELL 2.0, Tetrapixel, and Super-PD CMOS Image Sensor from the Google Pixel 7 Pro Rear Periscope-Telephoto Camera.

This report shows the latest development status of cellular vehicle-to-everything (C-V2X) communication technologies in the Chinese market including policy environment, technical standard progress, government-led demonstration pilot zones, and commercial deployment progress.

China smartphone market dropped -0.3% YoY in Q4 2023 by volume. It is the 11th consecutive quarter that the market posts annual decline and the whole year ended with -6% YoY decline rate. Vendor wise, Apple underperformed the market but regained the top position in China market in Q4. Honor and vivo ranked the second and the third, followed closely by the surging Huawei.

The Apple Watch Series 9 features a system-in-package (SiP) module that contains a TSMC manufactured integrated fanout package-on-package (InFO-PoP). This configuration has been observed before, but in the S9 the InFO-PoP houses a PMIC die alongside the processor at the bottom of the PoP, in a first for Apple.

The Apple Watch Series 9 features a system-in-package (SiP) module that contains a TSMC manufactured integrated fanout package-on-package (InFO-PoP). This configuration has been observed before, but in the S9 the InFO-PoP houses a PMIC die alongside the processor at the bottom of the PoP, in a first for Apple. Multiple second sourced PoP memory packages were documented during analysis.