Explore the cutting-edge landscape of the semiconductor market as we approach the end of 2023. Our latest Microprocessor Report provides in-depth insights into the imminent developments within three critical domains—Central Processing Units (CPUs), Artificial Intelligence (AI), and processor-adjacent technologies.

This is a Digital Floorplan Analysis (DFR) of the I/O die with AMD 2021 die markings found inside the AMD EPYC 9654 100-000000789 Genoa Server, which launched on November 10, 2022.

The global cellular baseband processor market grew 2% year-on-year (volume shipments) in Q3 2023 as the industry finally enters recovery territory. Major baseband vendors are now looking to grow non-handset growth opportunities as smartphone volumes stagnate.

The Murata SS3616043 is a millimeter-wave antenna module transceiver discovered in the Google Pixel 8 Pro. This Basic Floorplan Analysis focused on examining the fundamental characteristics of the antenna module. These included determining the minimum metal pitch, the minimum contacted gate pitch, the total number of metal layers, and the specific process technology used.

This report complements and discusses the recently published Q3 2023 data reports focused on Smart TV, Game Console, Digital Media Streamer, and Smart Blu-ray Player devices.

The KIOXIA/Western Digital 162-Layer (BiCS6) 3D NAND was developed in 2021. Significant differences with 112-Layer technology include lateral scaling advancement and circuit under array CMOS placement. This report presents a Memory Floorplan Analysis of the KIOXIA FXZ0_1T die found inside the Toshiba TH58LKT3V46BA8S package. The TH58LKT3V46BA8S was extracted from the DapuStor HaiShen5 7.68 TB H5100 SSD.

The Samsung Galaxy A05s SM-A057F saved on the Application/Baseband processor, using the Snapdragon 680, which is over $47 less than other application/baseband processors on average. Even though this is a Survey Plus Teardown, which does not include mechanical costs for the phone or the subsystem, it is unlikely the Galaxy A05s total subsystem prices exceed $146 to match the average total price of other mobile phones.

The FibocomFG650-CN is an IoT module that supports 5G connectivity in two network architectures: 5G independent networking (SA) and 5G non-standalone networking (NSA). It also supports LTE and WCDMA communications. This module is specially designed for China.

Several manufacturers share design wins in the Amazon Fire TV Soundbar EVG487. The audio Processor with memory was supplied by SunPlus, Texas Instruments supplied the 23 W Stereo Class-D audio amplifiers, 1 A Synchronous Buck Converter, and 3 A Step-Down DC-DC Converter. ESMT provided the EN25QH32B 4 MB serial flash memory.

China is the world's largest smartphone market. It delivers high volume and revenue to device makers, component suppliers and operators. Our extensive report shows the top-100 best-selling smartphone models in China in the third quarter of 2023.