Latest Reports and Analysis
Explore our popular analysis and the latest tech news on topics that matter to you.
Survey Plus Teardown of the Samsung A24 SM-A245/DSN Smartphone
Our analysis shows that most smartphones have a front camera with a sensor equal to or larger than 12 MP. We analyzed several smartphones that have a smaller sensor than 12 MP.
VanChip VC7643-63/H Multi-Mode Multi-Band (MMMB) Power Amplifier (PAM) Module Architecture Analysis
The following is a report of the VanChip VC7643-63/H Multi-Mode Multi-Band (MMMB) Power Amplifier Module (PAM) Architecture Analysis.
Deep Dive Teardown of the Google Pixel 7a GHL1X Smartphone
The GooglePixel 7a GHL1X is the latest budget smartphone from Google, succeeding the Pixel 6a. It was released on December 5, 2022. The mobile runs on the Android 13 operating system. This model (GHL1X) was made for Europe region.
Realtek RTL8720CM Winbond 35 nm 4Mb ePSRAM Memory Floorplan Analysis
This report (MFR) provides an analysis of the floorplan design used in the Realtek Wi-Fi&BT SoC RTL8720CM 4Mb ePSRAM manufactured in Windbond's Winbond 35 nm process technology and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets.
Autonomous Vehicle Carmaker Announcements
This database covers all the major carmaker announcements in regards to autonomous vehicles, both for semi and fully autonomous technologies.
From Tactile to Touch: The Interaction Continuum
Achieving a compelling in-cabin user experience is based on applying a mix or user interfaces within the vehicle.
Q2’ 2023: Samsung: Improved Profitability Despite Shipment Fall
Samsung shipped 53.5 million smartphones worldwide in Q2 2023, down -14% YoY, blaming to the mixed market demand brought by the global economic slowdown.
SunLune Technology Jasmier X4 Ethereum Miner ASIC XMC 40nm CMOS Process Digital Floorplan Analysis
This report provides an analysis of the floorplan design used in the SunLune Technology Jasmier X4 Ethereum Miner ASIC, fabricated on the XMC 40nm CMOS process, which incorporates DRAM DBI interconnect and includes an executive summary and supporting image sets SEM cross sectional and bevel imaging sets.
MediaTek MT6985W Dimensity 9200 Processor Package-On-Package with Integrated Organic Interposer Advanced Packaging Quick Look Analysis
This quick look report provides insight on the advanced packaging innovations used in the manufacturing of the MediaTek MT6985W Dimensity 9200 Processor, using TSMC's InFO-B process.
Deep Dive Teardown of the HTC Vive Elite XR 2QBB100 VR Headset
The HTC Vive Elite XR is HTC’s latest VR Headset which doesn’t require a base station. This model features five cameras instead of six as in the HTC Vive Cosmos.
Deep Dive Teardown of the Harman GMC Sierra Head Unit INFO3.7-3.8 CSM Automotive
The GMC Sierra is a full-size pickup truck manufactured by GMC (General Motors Truck Company). The Harman INFO 3.7-3.8 CSM is an infotainment system developed by Harman, a global technology company specializing also in automotive solutions.
NVIDIA H100 Hopper TSMC CoWoS-S Flip Chip Ball Grid Array
This report provides a deeper insight on the advanced packaging innovations used in the manufacturing of the nVIDIA Hopper GH100 GPU.
Lead-Sheathed Cable Risks Greatly Exaggerated
An investigative report in the Wall Street Journal claims that lead-sheathed cable in US telecom outside plant represents a public health and environmental hazard.
Preliminary Global Notebook PC Shipments and Market Share: Q2 2023 Results
Notebook PC shipments declined -13% in the second quarter of 2023 versus the same period a year ago and totaled 47.4 million.
GaN and Microwave Acoustics Take Center Stage at IMS 2023
GaN and Microwave Acoustics Take Center Stage at IMS 2023
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Advances in GaN devices for the millimeter wave took center stage at IMS 2023 with new products and R&D results from BAE, HRL, Intel
Solidigm 29F02P2BMCQLI 192-Layer 1.33 Tb QLC 3D NAND Flash Memory Floorplan Analysis
Solidigm 29F02P2BMCQLI 192-Layer 1.33 Tb QLC 3D NAND Flash Memory Floorplan Analysis
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This report (MFR) provides an analysis of the floorplan design used in the Solidigm 29F02P2BMCQLI 192-Layer
Semtech LR1121 LoRa Transceiver Floorplan Analysis (IoTB)
This report presents a basic floorplan analysis (BFR) of the Semtech LR1121 Long Range (LoRa) Transceiver.
Automotive Semiconductor Demand Forecast 2021 to 2030 - Q2 2023 Executive Summary
While the remnants of the COVID situation and the war in Ukraine, and subsequent fears over the global economy remain dominant factors impacting vehicle output in this update, TechInsights sees signs that semiconductor supply is starting to become less of an issue.
Qorvo QPG7015M Zigbee/Thread/BT 5.0 Controller Floorplan Analysis (IoTB)
This report presents a basic floorplan analysis (BFR) of the Qorvo QPG7015M Zigbee/Thread/BT 5.0 controller, extracted from the eero Pro 6E wireless router.
Samsung brings incremental improvements to 5th generation foldables
Samsung introduced its 5th generation Galaxy Z Flip5 and Fold5 foldable display smartphones today.
Samsung K3KL3L30CM-BGCT (K4L6E165YC Die) 16 Gb LPDDR5X SDRAM D1a nm Advanced Memory Essentials
This report presents an advanced memory essentials (AME) of the Samsung K3KL3L30CM-BGCT (K4L6E165YC Die) 16 Gb LPDDR5X SDRAM D1a nm, extracted from the Samsung Galaxy S23+ smartphone.
Thailand xEV System, Semiconductor and Sensor Demand Forecast 2021 to 2030 - July 2023
This TechInsights data model presents a view of the Thailand outlook for xEV systems and associated semiconductor and sensor demand.
West Europe xEV System, Semiconductor and Sensor Demand Forecast 2021 to 2030 - July 2023
This TechInsights data model presents a view of the West Europe outlook for xEV systems and associated semiconductor and sensor demand.
Sodium-Ion Batteries: Implementation in Electric Vehicles
TechInsights forecasts that almost 12 percent of all new battery electric light vehicles will be powered by sodium-ion batteries by 2030.
Swvl’s SPAC, Via’s Tech Ties Illustrate MaaS Successes, Struggles
International mobility-as-a-service (MaaS) companies Swvl and Via responded differently to the ongoing need for funding amid tepid post-pandemic ridership recovery and investors’ declining interest in shared mobility.
South Korea xEV System, Semiconductor and Sensor Demand Forecast 2021 to 2030 - July 2023
This TechInsights data model presents a view of the South Korea outlook for xEV systems and associated semiconductor and sensor demand.
Russia xEV System, Semiconductor and Sensor Demand Forecast 2021 to 2030 - July 2023
This TechInsights data model presents a view of the Russia outlook for xEV systems and associated semiconductor and sensor demand.
ROW xEV System, Semiconductor and Sensor Demand Forecast 2021 to 2030 - July 2023
This TechInsights data model presents a view of the ROW outlook for xEV systems and associated semiconductor and sensor demand.
NAFTA xEV System, Semiconductor and Sensor Demand Forecast 2021 to 2030 - July 2023
This TechInsights data model presents a view of the NAFTA outlook for xEV systems and associated semiconductor and sensor demand.
Japan xEV System, Semiconductor and Sensor Demand Forecast 2021 to 2030 - July 2023
This TechInsights data model presents a view of the Japan outlook for xEV systems and associated semiconductor and sensor demand.
Can Huawei Mate 70 Series Duplicate the Success of Mate 60 Pro?
Curious about the future of Huawei's flagship smartphones? Discover how the Mate 70 series stacks up against the highly successful Mate 60 Pro.
Discover the latest in semiconductor advancements and challenges in the November 2024 Chip Observer. Explore licensing disputes, trade shifts, domestic tool breakthroughs, and key industry milestones, plus insights on SiC, GaN, and Nintendo.
Cost Modeling ICs in Apple iPad Air 13” – #1 The M2 SoC
Explore the cost dynamics of Apple’s M2 SoC in the iPad Air 13". Learn how TechInsights’ IC Cost and Price Model reveals hidden costs and boosts strategic decision-making.
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