MediaTek MT6985W Dimensity 9200 Processor Package-On-Package with Integrated Organic Interposer Advanced Packaging Quick Look Analysis

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This quick look report provides insight on the advanced packaging innovations used in the manufacturing of the MediaTek MT6985W Dimensity 9200 Processor, using TSMC's InFO-B process. The analysis includes structural and materials analysis, and critical dimensions, providing information on form factor as well as insights into the architecture attributes that may relate to performance.

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