Realtek RTL8720CM Winbond 35 nm 4Mb ePSRAM Memory Floorplan Analysis
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This report (MFR) provides an analysis of the floorplan design used in the Realtek Wi-Fi&BT SoC RTL8720CM 4Mb ePSRAM manufactured in Windbond's Winbond 35 nm process technology and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets. The report provides process node and foundry identification, critical dimensions, memory and periphery functional block summaries, and die/package cost analysis.
