Latest Blogs and Commentary
OmniVision OV50H Device Essentials Plus
This report provides a detailed analysis into the structure of the OmniVision OV50H CIS. The analysis includes structural and material analysis and details of the structural dimensions, which are used to manufacture the image sensor and image signal processor (ISP) and a summary of the salient features observed.
Datacenter Computing Processors Q2 2024
The overall Datacenter Computing Processor market was $29.7 billion in Q1 2024, close to +200% year-over-year (3x), driven by stellar GPU shipments and sustained ASIC demand. The CPU and FPGA markets are bottoming out with accelerated year-over-year growth expected through 2024.
Deep Dive Teardown of the Bosch MRR1Plus Radar Sensor
The Bosch MRR1Plus (5Q0 907561B) automotive radar sensor uses 77 GHz front-end radar transmitter and receiver ICs from Infineon.
Wearable Battery (Amazon Echo Frames-3rd Gen) Battery Characterization
In addition to the battery essentials report (BEF-2312-801) that recently provided important structural and morphological insights, this report presents a Battery Characterization (BCR) analysis of the Desay 26S1029 Li-ion battery extracted from the Amazon Echo Frames 3rd Generation smart glasses.
Analysis - Smartphone Fingerprint Sensor Market Share Q1 2024
The market for smartphone fingerprint sensors secured over 5% revenue growth in Q1 2024. Qualcomm took the top spot followed by Goodix and Egis Technology in the quarter.
STMicroelectronics VB1940, VD1940 Standard Floorplan Analysis
Insight into the structure of the STMicroelectronics VB1940 CMOS image sensor ISP die for automotive applications, which is a 5.1 MP, 1/2.5” stacked back-illuminated RGB/NIR technology CIS with a pixel pitch of 2.25 µm.
Synaptics VS680 AI SoC Digital Floorplan Analysis
The Synaptics VideoSmart VS680 AI SoC found in Banana Pi BPI-M6 single board computer, using TSMC 12nm CMOS FinFET (likely 12FFC) process.
Quectel RG255C-GL 5G Red-Cap Deep Dive Teardown
Quectel announced RG255C-GL module with 5G reduced capacity sub-6GHz on April 9, 2024 designed for global market. It is embedded with Qualcomm Snapdragon SDX35 Baseband Processor and JSFCBA3YH3BBG-425 RAM/NAND memory from Jeju Semiconductor.
Tracker: VALUE SHARE: Global Smartwatch Revenue and ASP by OS by Price Tier: 2024 Q1
Global smartwatch revenues fell by 4% YoY during Q1 2024. The decline was driven by slumping shipment volumes and declining ASPs due to macroeconomic weakness and geopolitical uncertainty limiting consumer demand and discretionary spending and causing a lengthening replacement cycle.
Tracker: Global Top-500 Smartphone Shipments, ASP, and Price Band by Model with Specs: Q1 2024
The models included in the report cover 90% of the total smartphone shipments in Q1 2024, including all major vendors as well as many locally significant microvendors.
Samsung Foundry's Next-Gen GAA Process Expected in Galaxy Watch 7
Discover the latest innovation from Samsung Foundry with their next-gen GAA process expected in the Galaxy Watch 7. TechInsights analysts provide insights from the Samsung Galaxy Unpacked Conference, building on last year's groundbreaking SF3E process technology.
Webinar - 2024 is the Year of the AI PC: Hype or Reality?
Explore the potential of 2024 as the Year of the AI PC. Join TechInsights’ experts David Watkins and Eric Smith to discuss the emerging AI PC market, sales projections, and the future of computing.
Unknown 122B050-A1 SAW Filter (90SSPNWAM) Acoustic Wave Filter Report
This process analysis report examines the TF-SAW filter die, marked 122B050-A1, located in the 90SSPNWAM mid-high band power amplifier with an integrated low noise amplifier and duplexer (MHB L-PAMiD) within the Huawei Nova 12 Pro (ADA-AL00) 5G smartphone.
Apple A17 Pro SoC CPU Design Analysis
This report provides an analysis of the standard cells comprising about 70% of the area analyzed in the logic block of the Apple A17 Pro SoC CPU. Standard cells schematics are extracted to determine routing efficiency, gate density and global metal usage survey.
HiSilicon Hi1105-GFCV100 Wi-Fi SparkLink SoC Advanced CMOS Process Analysis
The HiSilicon Hi1105GFCV100 WiFi/BT/GNSS SoC was fabricated using HLMC’s 28nm HKMG planar RF CMOS process. The report includes a summary of key findings, and a detailed look at the FEOL, MOL and BEOL structures and materials used. Extensive SEM, TEM and materials analysis provide a complete look at how this device was manufactured.
AMD Z1 Extreme APU Digital Floorplan Analysis
This blog compares Samsung’s S6565 and S6566 Wi-Fi 6/BT 5.3/FM SoCs based on the published floorplan and RF architecture analyses. Special attention is given to the die area consumption by the RF sections. Some conclusions are offered based on specific layout changes.
Illustrations of the Design Progression from Samsung’s S6565 to their S6566 Wi- Fi 6/ BT 5.3 SoC
This blog compares Samsung’s S6565 and S6566 Wi-Fi 6/BT 5.3/FM SoCs based on the published floorplan and RF architecture analyses. Special attention is given to the die area consumption by the RF sections. Some conclusions are offered based on specific layout changes.
Tracker: VALUE SHARE: Global Smartwatch Revenue and ASP by Vendor by Price Tier: 2024 Q1
Global smartwatch revenues shrunk by 1.5% in Q1 2024 due to declining shipment volumes as well as shrinking ASPs caused by macroeconomic weakness and geopolitical uncertainty limiting consumer demand and discretionary spending.