Latest Blogs and Commentary
Tracker: Global Wearables Vendor Volume Share Q4 2024
Global wearables shipments rose 4% in Q4 2024 as Apple, Huawei & Samsung compete. Track quarterly market share across all wearable device types.
2025-04-03 - Subsystem and OEM Inventory
Gain insights into quarterly inventory spending for CSUBs and OEMs—segmented by materials, spares, WIP, and goods—across 160+ public suppliers.
Week ending March 28, 2025: Analog & Power IC Sales Decreased YoY
Semiconductor sales flat WoW, up 17% YoY. This complimentary update adds context to the weekly Semiconductor Analytics report.
Semiconductor Analytics – April 2, 2025
Track weekly semiconductor sales trends—flat vs. last week, up 17% YoY. Covers ICs, DRAM, NAND, Logic, Analog & Power, and Automotive chips.
China Analysis: NAURA’s $5B Surge and China’s Semiconductor Equipment Consolidation Wave
Analyze NAURA’s growth as China’s first integrated WFE platform, 2025 outlook, policy drivers, tech gaps vs. AMAT, and key M&A strategies.
Narrative: Global Top-200 Smartphone Shipments, ASP, and Price Band by Model: Q4 2024
Explore Q4 2024's top 200 best-selling smartphones by shipments, ASP, and price band. Report includes flat file and pivot table for custom analysis.
Analysis: WFE Forecast Summary
Explore historical trends and 5-year forecast of the Wafer Fab Equipment (WFE) market with annual data, updated quarterly for accurate insights.
Insight: Most Wafer Production Costs Fell in 2024 and are Expected to Continue to Drop in 2025
Explore TechInsights' SME model for wafer production costs—covering frontend steps to sawing/dicing for hundred of processes from IDMs and foundries.
Inside Blackwell: The Secrets Powering NVIDIA’s AI Supremacy
Discover the secrets inside NVIDIA Blackwell B200. TechInsights reveals exclusive insights into its architecture, packaging, and HBM3e memory.
Impact On Semiconductor Manufacturing Emissions Vary By Region
Scope 2 emissions dominate semiconductor manufacturing. See how location impacts emissions and explore regional differences for a greener footprint.
Samsung HBM3 from AMD Instinct MI300X HBM Interconnect and Packaging Analysis
Explore Samsung's HBM3 advanced packaging with 12Hi DRAM stacks, TSVs, and micro-bumps, powering AI and HPC with high bandwidth and efficiency.
Agentic AI: Driving the Next Frontier in Compute Investment
Semiconductor equipment order activity dropped last week. This complimentary report accompanies the Industry Performance Data Table.