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ODM Sales Soar as Hyperscalers and Cloud Providers Go Direct
TechInsights' 2023 server market analysis shows that the world spent $120 billion on over 13.5M servers in 2023.
Survey Plus Teardown of the Motorola Moto G Play Gen 3 XT2413-2 Smartphone
The Motorola Moto G Play XT2413-2 3rd Gen is the latest model in the Moto G Play series, succeeding the 2nd Gen Moto G Play. This smartphone boasts a Qualcomm Octa-Core Snapdragon 680 Applications/Baseband Processor built with 5 nm technology, as well as 4 GB Mobile LPDDR4X SDRAM from Samsung and Samsung’s 3D TLC V-NAND Flash Memory with a capacity of 64 GB. The previous model, on the other hand, was equipped with MediaTek’s Helio G37 with 12 nm technology.
NAB 2024: Key Takeaways for Connected TV
This report summarizes major ASTC 3.0 related announcements at the 2024 National Association of Broadcasters Show (NAB). Companies mentioned include LG, Samsung, Sony, TCL, Hisense, Mediatek, iWedia, Realtek, ADTH, Stavix, Velo, Zapperbox, and Zinwell
Market Shares: Compute Servers Q4 2024
This workbook breaks down the revenue from the sales of servers in 2023 by vendor. In 2023, 13.6M servers were shipped globally, with a combined value of $121B. With cloud providers selling access to infrastructure, and hyperscalers providing services from vast server estates, its perhaps not surprising that the role of original design manufacturers (ODMs)—which ship custom servers to large entities—is becoming more relevant.
Smartphones: Global Artificial Intelligence and Sensor Technologies Forecast to 2029
Artificial Intelligence (AI) is an integral part of a modern smartphone. Edge AI computing is pushing more processing on-device as vendors use more AI in several areas. Virtual assistants such as Siri, Bixby and Google Assistant are already becoming commonplace and on-device AI is increasing their abilities. Generative AI has emerged to turbocharge AI capabilities.
Analysis: As TV Manufacturers’ Revenue Models Evolve, Samsung, LG, and Vizio Shift Their Focus to Advertising
The television manufacturing business is changing. Long a high volume (units sold), high gross revenue, low margin business, the development of connected TVs and free ad-supported TV (FAST) services, is fundamentally changing the TV manufacturer business model, at least for those manufacturers that have an in-house (i.e., first-party) TV operating system (TV OS).
Analysis: Global Foldable Smartphone Shipments Forecast and Revenues
Samsung was the leader in foldable-display smartphone shipments in Q4 2023, followed by Huawei and Motorola. Shipments grew YoY, but major markets in North America and Western Europe declined heavily because of ongoing geopolitical and economic turbulence and Samsung's softness.
Huawei Pura 70 Series Image Sensors
There are expectations that Huawei will move away from SONY to use made-in-China image sensors in the Pura 70 series. This report provides insight into the image sensors used in the Huawei Pura 70 series.
Deep Dive Teardown of the Magna Electronics ADAS GP009379212 Automotive
Launched in 2023 by the USA vehicle company Fisker, the mid-size electric crossover SUV. The Fisker Ocean is equipped with an array of advanced driver assistance systems (ADAS). Utilizing computer vision, radar, and diverse sensors, these ADAS features enhance safety and comfort for the driver.
Deep Dive Teardown of the Apollo Zhilian Cockpit Domain Controller CDC? Automotive
Several manufacturers share the design wins for Apollo Zhilian for Jidu Robo-01 Cockpit Domain Controller. The main processor came from Qualcomm® Snapdragon Automotive generation. The Qualcomm SA8295P is a high-end processor, made with 5 nm FinFET process, featuring an octa-core CPU. Renesas supplied the 32-Bit Microcontroller from RH850 family created among others for automotive electronics.
Survey Plus Teardown of the Honor Magic 6 BVL-AN00 Smartphone
The Honor Magic 6 comes with a 6.78-inch OLED touchscreen display offering a resolution of 2800 × 1264. The display has a frequency of 120 Hz. The phone is powered by a Qualcomm SM8650-002-AB Applications/Baseband Processor.
Survey Plus Teardown of the Vivo S18 5G V2323A Smartphone
The Vivo S18 is equipped with the Qualcomm Snapdragon 7 Gen3 processor. This phone is powered by a 5000 mAh battery with support for 80 W fast charging. The SIM card tray can accommodate two nano-SIM cards.
Deep Dive Teardown of the ecobee Smart Thermostat ECB601 Home Thermostat
The ecobee Smart Thermostat ECB601 is designed to control home heating and cooling systems directly from the phone app or voice commands with Siri or Alexa to create heating and cooling schedules as well as view energy usage reports.
Analysis: Global 5G and LTE Handset Revenue and ASP by Vendor – Q4 2023
Global 5G handset industry revenues and shipments grew double digits in Q4 2023. Apple remains the leader of 5G shipments and revenues, but Samsung is growing behind Apple. Samsung is the world’s second-largest 5G vendor in terms of shipments and revenues.
Autonomous Vehicle Carmaker Announcements
This database covers all the major carmaker announcements in regards to autonomous vehicles, for both semi- and fully autonomous technologies. Comments are embedded in the "Release Date" column to give further details, e.g., "End of 2024". In this update, TechInsights has included announcements and releases of different ADAS and automated driving platforms by SAE Levels of automation from automakers and Tier 1 developers worldwide.
Deep Dive Teardown of the Caterpillar S75 BM1S1B Smartphone
The Main Cover is a Co-Molded Reinforced Plastic Frame. It consists of a Glass-Filled Plastic Inner Frame and Soft Plastic Outer Frame. Waterproof elements available in the construction of devices for: Sealed Buttons Port with rubber membrane, Sealing Tape around the Main Enclosures, Silicone Gasket on Sim Tray Cover, and Sealing Tape around Cameras Windows and Camera Window's Positioning Handle.
Deep Dive Teardown of the ecobee Smart Doorbell EB-CAMSDB-01 Doorbell Camera
The Ecobee Smart Doorbell Camera is a smart home security system unit equipped with a 175-degree vertical view camera. It can stream a live view to Ecobee Smart Thermostat through low energy communication system of BT 5.0 and 2.4/5 GHz WiFi.
Forecast: Global 5G Smartphone Wholesale ASP & Revenue by Technology to 2029
Global 5G smartphone wholesale revenues will surge between 2019 and 2029. 5G is by far the fastest-growing sector of the smartphone industry for the next decade. The majority of mmWave sales volumes will come from the North American market. Sub-6GHz will remain the main 5G technology for the foreseeable future.
SK hynix Hi-5021Q 50MP 0.70μm Pixel CMOS Image Sensor Device Essentials Plus
The Hi-5021Q is a 50 MP, 0.70 µm stacked back illuminated CMOS image sensor. It is the first SK hynix image sensor analyzed by TechInsights to use hybrid bond to connect the CIS and ISP dies. This is also the first commercially available image sensor to use an air gap grid.
Deep Dive Teardown of the Xiaomi Redimi K70 Pro 23117RK66C Smartphone
Both smartphones also have the same battery charging design with the only exception that Xiaomi 14 Pro has Wireless charging capabilities. It is also similar to the Xiaomi Redmi Note 13 Pro’s design with a difference in which main SoC (SC8551A) was used.
Deep Dive Teardown of the Fitbit Charge 6 G3MP5 Activity Tracker
The Fitbit Charge 6 G3MP5 is the latest activity tracker from Fitbit Inc. and an improved successor to the Fitbit Charge 5 FB421. The Charge 6 has a 1.04” OLED Display. In both devices, the Display/Touchscreen Subsystem is made by Truly Opto-electronics and has the same part number. The Display Panel and touchscreen Module are separated in this subsystem.
Samsung K9DYGY8J5B-CCK0 236L 1Tb 3D NAND Internal Waveform Analysis
The Samsung 1 Tb 236L triple-level-cell (TLC) 3D NAND flash memory device (die markings: K9AKGD8J0B) is one of 16 dies packaged inside one Samsung K9DYGY8J5B-CCK0 NAND flash memory package, which was found in the MZ-V9P4T0 990 Pro PCIe 4.0 NVMe M.2 4 TB solid state drive (SSD).
Sony LYTIA LYT900 50MP 1.6μm Pixel ISP Die Standard Floorplan Analysis
The Sony LYTIA LYT900 is a rear wide-angle camera module that was extracted from the Oppo Find X7 Ultra (PHY110) smartphone. The camera module measures 27.96 mm × 31.16 mm × 10.68 mm thick. It contains a stacked imager comprising a CIS die and an ISP die. This floorplan analysis (FAR) examines the ISP die.
Value Share: Global Smartphone Vendor ASP and Revenue Share by region: Q4 2023
Global smartphone industry revenues grew by 8% in Q4 2023. Apple, Samsung and Xiaomi were the top three vendors and together accounted for 3/4th of the global revenues. Apple was the leading vendor by revenues in all of the six regions tracked.
Forecast: Global 5G Smartphones by Technology up to 2029
We expect mmWave technology to reach 11% penetration of all 5G smartphones in 2023. The majority of sales volumes come from the North American market.
Deep Dive Teardown of the Huawei Eyewear 2 LFT-G00 Smart Glasses
The Huawei Eyewear 2 LFT-G00 are smart glasses that include two speakers in the temples to create a comfortable open-ear audio listening experience without the need for earpieces. It features the WUQI microelectronics WQ7036AX Bluetooth 5.3/Audio SoC with memory.
Efficient Power Conversion EPC2619 100V 3.3mOhm Gen 6 GaN Transistor Power Essentials
The Efficient Power Conversion EPC2619 device includes a single gallium nitride (GaN) power high electron mobility transistor (HEMTs) die with a continuous rating voltage of 100 V, the power GaN transistors operate in enhancement mode (normally-off) and exhibit a typical 3.3 mΩ on-resistance (RDS(ON)) at 5 V VGS bias.
Apple Watch Series 9 (S9 SiP) Digital Floorplan Analysis
The Apple TMQW67 die, examined in this digital floorplan analysis (DFR), was found inside the Apple S9 module. The Apple S9 system-in-package (SiP) module was extracted from the Apple Watch Series 9 GPS+Cellular (A2984).
Micron D1β LPDDR5X DRAM Process Full Flow Analysis
A Synopsys 3D-emulation analysis of the process flow and integration used in the manufacture of the Micron Technology MT62F1G64D4AM-031_XT_C (Y52P die), built in Micron’s D1b nm technology. The emulation includes SPX input files that can be used as input into other Synopsys models.
STMicroelectronics Ouster OS1 LiDAR SPAD Array Sensor – L3 Chip Process Flow Analysis
The STMicroelectronics Ouster L3 Chip with 10 µm pixel pitch is the third-generation LIDAR chip. It is a stacked back-illuminated direct Time-of-Flight (d-ToF) SPAD sensor, which competes directly with the SONY IMX459. The L3 SPAD chip has many innovations, including hybrid bonding, in die quench resistor, dual DTI pixel isolation, finger capacitor, and diffraction grating.
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