Chiplet Technology: Disrupting Chip Design and Fueling Growth

The semiconductor industry is facing a turning point with the rise of chiplet technology (also known as chiplet-based design or semiconductor chiplet technology). This revolutionary approach has been made possible by the advances in chip-to-chip interconnect and is poised to reshape chip production and design, particularly within the computing segment.
15Jul

Apple R1 Adopts TSMC’s Latest Package

Apple’s R1 sensor hub chip in the Vision Pro AR/VR headset is the first use that TechInsights has seen of TSMC’s InFOM advanced packaging technology. The R1 has a 5nm processor chip plus two LLW DRAMs linked by short very-high-density interconnect to speed up the data processing.
15Jul

LiDAR Technology in Apple Vision Pro

Spatial computing is a highlight of the new Apple Vision Pro headset. This device uses various sensors to integrate virtual and physical environments by sensing the three-dimensional structure of the user's space and eye movements.
13Jul

The Chip Observer (June Edition)

Dive into the latest Chip Observer for June 2024! Explore major advancements in AI PCs, competitive shifts in datacenter GPUs, and insights on the recovering memory market. Discover how NVIDIA’s dominance is being challenged and get the scoop on IBM’s strategic moves.
12Jul