Market Data: Smartphone Memory Market Share Q2 2025
Explore Q2 2025 smartphone memory trends as revenues fell 15%, shipments slowed, and Samsung led with over 50% market share.
Apple iPhone Air Unboxing
The new Apple iPhone Air — Apple’s slimmest iPhone yet at 5.62 mm, featuring the A19 Pro processor, N1 connectivity chip, and updated C1X modem. Explore TechInsights’ ongoing analysis of the iPhone Air.
TechInsights Outlook Summit Series 2026
Join TechInsights’ 12 free webinars in the 2026 Outlook Summit Series to explore trends in AI, memory, compute, mobile, automotive, packaging, and consumer electronics. Register now.
5 Expectations for the Connectivity Market in 2026
Join TechInsights on Nov 19/20, 2025, for a free webinar exploring five key trends in connectivity semiconductors for 2026, from 5G densification to ambient compute and always-on RF.
North America Tablet Vendor & OS, Unit & Value Market Share by Country: Q2 2025 Results
Explore tablet market trends from 2017–2025 with forecasts to 2026, covering shipments, values, and ASPs by vendor and OS.
Market Data: Digital Media Streamer Vendor and Model Market Share Q2 2025 by Country
Track Digital Media Streamer market share with quarterly shipment and installed base data across 30 countries.
Manufacturing Database: Summary
Access TechInsights’ semiconductor manufacturing reports with forecasts and quarterly data on capacity, production, sales, and capex.
2025 TechInsights Memory Market Webinar
Discover what’s next for memory markets at the 2025 TechInsights Webinar, Sept 18.
AI Model Trends Q3 2025: Small Models Surge as Total Count Doubles
TechInsights projects over 2.5M AI models in 2025, nearly doubling year-over-year, with small models and multimodal AI driving the next wave of innovation.
System Carbon Module
The EcoInsights System Carbon Module empowers product designers, engineers, and sustainability leaders to evaluate the full carbon footprint of electronic assemblies using the most accessible data available and leveraging a Bill of Materials (BOM).