Teardown Unboxing: Exploring the Vivo X Fold3 Pro

Explore the innovative design and advanced features of the Vivo X Fold3 Pro, the thinnest foldable smartphone on the market. Learn about its durable carbon fiber hinge, Vivo Armor architecture, and premium aesthetics in our detailed Teardown and analysis.
24Jun

Intel FIVR gets a new inductor

Explore Intel's latest Coaxial Magnetic Integrated Inductor (Coax MIL) technology, enhancing voltage regulation in high-performance processors like Sapphire Rapids. Discover its impact on Intel's shift from on-motherboard to fully integrated voltage regulation and future developments in processor architecture.
19Jun

Apple A17 Pro SoC Small CPU Design Analysis

Dig into this analysis of the standard cells comprising 70% of a target logic area in the the Apple A17 Pro CPU2 core, fabricated using FINFLEX methodology by TSMC in N3B process node. Standard cells schematics are extracted to determine routing efficiency, gate density, and global metal usage survey.
19Jun

Towering Memory: HBM and Verticality

Discover how the AI arms race is driving advancements in high bandwidth memory (HBM) technology, with AMD, NVIDIA, Google, and Meta pushing the limits of DRAM stacking. Learn about JEDEC's updates, hybrid bonding innovations, and their impact on data center performance.
19Jun

Automotive Market Outlook Report

Automotive Market Outlook Report Automotive Semiconductor Forecast and Vendor Share Discover the latest Automotive Market Outlook Report, analyzing Q1 2024 trends and challenges in the automotive semiconductor landscape. Amid geopolitical tensions and economic concerns, our forecast and TechInsights
18Jun