Part of a radio subsystem, Qualcomm’s Snapdragon X75 modem for 5G simplifies boards by interfacing with a better-integrated RF transceiver. It also increases performance through more AI horsepower, enhanced uplink technology, and denser QAM.

Intel has refreshed its midrange FPGAs, challenging market newcomers. The new family updates the fabric, CPUs, and DSPs while expanding the Agilex line.

Think Silicon is among the few companies developing low-cost, low-power GPU IP, offering cores to accelerate 2D, 2.5D, and 3D graphics. The new Nema Pico VG adds support for vector graphics, enabling slick GUIs.

The smartphone market experienced record-low shipments in 2022. Many smartphone manufacturers are looking to revive the market in 2023 and beyond, and Samsung’s recently released S23 Ultra shows promise to help with this revival.

SPIE ALP. Inventory out of control. G. Dan Hutcheson The Chip Insider® SPIE Advanced Lithography and Patterning 2023: This is the penultimate conference on advanced lithography. Like many things, it goes through cycles of emergent behavior transitioning between chaos and order. Back between

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Radio design is characterized by tighter module integration with increased number of filters, switches, antenna tuners, and directional couplers.

Watch an exclusive sneak-peek video of our experts tearing down Samsung’s latest flagship smartphone release, the Samsung Galaxy S23 Ultra. Get an initial preview of the device’s technology components like the impressive 200-megapixel camera that gives users incredible photo quality rarely seen in the smartphone market.

Curious about the latest breakthroughs in battery technology? Look no further than Tesla’s new 4680 battery cells. These innovative cells are designed to not only be larger and more energy dense, they also have a hidden feature: three terminals instead of the standard two.