The New Normal for Inventory. Fab-lite companies becoming Fabbed. G. Dan Hutcheson The Chip Insider® The New Normal for Inventory: One of TechInsights’ most important indicators is the Inventory-to-Billings ratio, or the IB ratio. Currently there is a general belief by many that inventories are too

TechInsights ForecastPro Advanced Packaging Upload Updates included are the following: ForecastPro: Packaging Demand Forecast – v22.11 Advanced Packaging Demand Forecast – v22.11 The highest-growing packaging segments were LGA and QFN followed by CSP/WLP in 2021, in 2022 the fastest-growing segments

Proprietary technology helps startup Blue Cheetah rapidly create custom die-to-die interconnects, including analog circuits, to attach chiplets. Focusing on the BoW standard, the company supports two fab processes.

Chiplet use is increasing, primarily for large in-house computing projects, but small chip designs don’t benefit. A broad third-party chiplet market remains years away.

The TPUv4 is now generally available through Google Cloud, although the company has used it internally for a year. The ASIC doubles the number of matrix units relative to the TPUv3.

In the ever-evolving world of wearable technology, Apple has consistently pushed the boundaries of innovation. Their latest offering, the Apple Watch Series 8 A2771, is no exception. Packed with cutting-edge features and impressive hardware, this watch promises to redefine what we can expect from a smartwatch.

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

TechInsights Critical Subsystems Ceramic Electrostatic Chucks on the Platform Summary data from Ceramic E-Chuck Report is now available on the TechInsights Platform: Driving Forces Misc. Reports Ceramic E-Chucks 221116 We recently completed a focused report on ceramic electrostatic chucks for

TechInsights' Semiconductor Analytics report

It’s cold and foggy… Shereen Vaux Order activity for semiconductor equipment extended its decline, slipping one point to 62 degrees Subcons/Advanced packaging was the only segment to increase last week which could be signaling a turn around in business sentiment All other segments declined with