STMicroelectronics ISP Die from VB56G4A 1.5 MP Resolution 2.61 μm Pixel Pitch CIS Camera Module Standard Floorplan Analysis

STMicroelectronics ISP Die from VB56G4A

 
Share This Post
 
 

This report presents a standard floorplan analysis (FAR) of the STMicroelectronics ISP Die from VB56G4A 1.5 MP resolution, 2.61 μm pixel pitch CIS camera module.

Read the full report

The authoritative information platform to the semiconductor industry.

Discover why TechInsights stands as the semiconductor industry's most trusted source for actionable, in-depth intelligence.