This report presents an advanced packaging quick look analysis (APQ) of the AMD Ryzen 9 7950X3D (with second generation 3D V-Cache) processor TSMC SoIC package technology. The analysis includes structural and materials analysis, and critical dimensions, providing information on form factor as well as insights into the architecture attributes that may relate to performance.
Chips, China, and Consequences: Navigating the Impact of Trump's Technology Tariffs
Explore how U.S. technology tariffs are reshaping global chip markets in Chips, China, and Consequences, an exclusive TechInsights eBook. Available only on the TechInsights Platform.
Maximize Wafer Efficiency with TechInsights’ Die Calculator
The Die Calculator from TechInsights empowers engineers, procurement specialists, and finance teams with the insights they need to understand die utilization and yield with confidence.
Earth Day 2025: A Progress Report on Sustainable Semiconductor Manufacturing
Can the chip industry scale innovation and sustainability? Discover the current state of green tech in one of the world’s most energy-intensive sectors.
