A post-pandemic 'Next Normal' has yet to emerge for many wireless operators globally, with more normal mobility patterns offset by market volatility caused by supply chain challenges, inflationary pressure on costs and end-user affordability, and persistent macro-economic uncertainty.

TechInsights Automotive Infotainment & Telematics Q3 2023 Vendor Market Shares & OEM Features report provides an overview of System Vendor and Chipset Vendor market shares, as well as a range of key features by OEM including Telematics, Navigation, Smartphone Projection, Displays, Operating Systems etc.

TechInsights Automotive Infotainment & Telematics Q3 2023 System Market Report provides a forecast outlook for OEM and Aftermarket hardware and feature market from 2020 through 2030.

TechInsights' Automotive Infotainment & Telematics Q3 2023 Semiconductor Market Report provides a forecast outlook for OEM and Aftermarket hardware and applications market from 2020 through 2030.

TechInsights Automotive Infotainment & Telematics Q3 2023 System Market Report provides a forecast outlook for OEM and Aftermarket hardware and feature market from 2020 through 2030.

TechInsights’ Automotive Infotainment & Telematics Q3 2023 Semiconductor Market Report provides a forecast outlook for OEM and Aftermarket hardware and applications market from 2020 through 2030.

IBM’s Strategy, Vision, and Ecosystem G. Dan Hutcheson The Chip Insider® Summary: IBM’s Strategy, Vision, and Ecosystem: Eight years ago… I visited IBM at Albany NanoTech Complex, which contains the company's semiconductor research center, to answer the question of how would it work … You see

Intel’s new accounting approach gives financial responsibility to manufacturing, treating business units as internal customers. This greater accountability should help the overall profitability and competitiveness of its foundry business.

Microcontrollers from STMicroelectronics feature prominently in MLPerf Tiny v1.1 results, and Plumerai’s inference engine demonstrates how it speeds up model execution.

Near-term order visibility remains low as semiconductor markets get past the bottom Shereen Vaux Order activity for semiconductor equipment increased but remains at a chilly 43 °F. As expected, TSMC is planning to double its CoWoS capacity next year as it remains a bottleneck for AI. In addition