i.MX91 Targets Simple Edge Systems
NXP’s i.MX91 addresses simple edge applications with a feature subset of the i.MX93, maintaining pin compatibility and reducing power.
Cortex-X3 Proves Its Area Efficiency
TechInsights’ floorplan analyses of smartphone processors reveal the size of CPUs and caches.
NVIDIA H100 Hopper TSMC CoWoS-S Flip Chip Ball Grid Array
This report provides a deeper insight on the advanced packaging innovations used in the manufacturing of the nVIDIA Hopper GH100 GPU.
Dimensity 6100+ Lags at Low End
Qualcomm’s Snapdragon 4 Gen 2 offers more-powerful CPUs and faster DRAM than MediaTek’s Dimensity 6100+, but neither new chip delivers much improvement to low-cost smartphones.
Lead-Sheathed Cable Risks Greatly Exaggerated
An investigative report in the Wall Street Journal claims that lead-sheathed cable in US telecom outside plant represents a public health and environmental hazard.
Preliminary Global Notebook PC Shipments and Market Share: Q2 2023 Results
Notebook PC shipments declined -13% in the second quarter of 2023 versus the same period a year ago and totaled 47.4 million.
GaN and Microwave Acoustics Take Center Stage at IMS 2023
GaN and Microwave Acoustics Take Center Stage at IMS 2023 Share This Post Advances in GaN devices for the millimeter wave took center stage at IMS 2023 with new products and R&D results from BAE, HRL, Intel, NGC Qorvo, Wolfspeed, and others. Acoustic wave filters for higher frequencies showed
Mobile Carriers
Empowering mobile carriers to excel in an ever-evolving industry, ultimately benefiting consumers through enhanced connectivity, improved services, and innovative solutions.
Solidigm 29F02P2BMCQLI 192-Layer 1.33 Tb QLC 3D NAND Flash Memory Floorplan Analysis
Solidigm 29F02P2BMCQLI 192-Layer 1.33 Tb QLC 3D NAND Flash Memory Floorplan Analysis Share This Post This report (MFR) provides an analysis of the floorplan design used in the Solidigm 29F02P2BMCQLI 192-Layer 1.33 Tb QLC 3D NAND Flash, and includes an executive summary and supporting image sets
