Neo Takes DRAM To a New Dimension

Neo’s 3D X DRAM technology promises an 8× increase in DRAM capacity with a per-bit cost one-sixth that of conventional DRAM. The company seeks a partner for silicon implementation.
14Aug

Intel PowerVia Bypasses Frontside Metal

At the recent VLSI Symposia, Intel presented three papers discussing PowerVia technology: one on the technology itself, another on the results from a test microprocessor, and a third looking at the possible evolution of PowerVia.
14Aug