Latest Blogs and Commentary
Huawei's Q4 2023 Resilience in China Market
Despite facing stiff competition from Apple in the mid- to premium-tier segments, Huawei's performance during China's 11.11 online shopping festival solidified its position as a top contender.
Automotive Semiconductor Vendor 2023 Market Shares Data
This datasheet presents TechInsights analysis of 2023 automotive sector revenues and market shares of the leading semiconductor vendors, with revenue splits by major component product category and by region including N. America, Europe, Japan, China, South Korea and ROW. It also includes market shares and revenue splits for previous years extending back to 2010.
Sony IR Eye Tracking 1.8MP Camera from Apple Vision Pro Package Analysis
The Apple Vision Pro augmented reality headset uses four inferred cameras to track its wearer’s eyes. This report catalogues the structure of those camera modules, how they fit into the headset, and provides an overview of the Sony back-side illuminated CMOS image sensor that they house.
OmniVision OX03D4C 1/4" 3MP 2.1μm Pixel CMOS Image Sensor Device Essentials Plus
The OmniVision OX03D4C is a color, 3-megapixel (MP) resolution stacked back-illuminated (BI) CMOS image sensor (CIS) with a 1/4-inch optical format, LED flicker mitigation (LFM), and 140 dB high dynamic range (HDR) for automotive applications.
Micron Q1 2024 (FY Q2 2024) Report Summary
Discover the highlights of Micron's Q1 2024 report, showcasing impressive growth and strategic advancements in the semiconductor industry. Gain insights into Micron's market outlook and innovative initiatives shaping the future of semiconductors.
DRAM IC Sales Up 81% YoY the week ending March 22, 2024
Semiconductor sales were down 2% last week but increased 19% from this time last year. Zooming in on DRAM IC, the 13-week MA jumped 81% YoY last week.
Baidu Kunlun II A2S1CAXGA SoC Packaging Quick Look Analysis
This is an Advanced Packaging Quick Look (APQ) summary document for the Baidu Kunlun Xin A2S1CAXGA processor, provided as a companion deliverable for the APQ-2312-801 project. The Baidu Kunlun Xin processor, also referred to as the Kunlun II, is the second-generation of the Baidu Kunlun processor series.
Renesas, TSMC Embed Fast MRAM
Renesas and TSMC demonstrated two uses of fast MRAM at ISSCC. Renesas targets faster NVM; TSMC targets working memory. Their tradeoffs are very different.
ST Introduces Its First 64-Bit SoCs
The STM32MP2 devices integrate up to two Cortex A35 CPUs with a substantial number of I/Os for embedded industrial applications.
Survey Plus Teardown of the Xiaomi Redmi Note 13 23129RAA4G Smartphone
The Redmi Note 13 comes with a 120 Hz, 6.67-inch AMOLED touchscreen display offering a resolution of 1080 x 2400. Xiaomi Redmi Note 13 has four cameras.
Survey Plus Teardown of the Samsung Galaxy A15 SM-A155M Smartphone
Most of the main SoC in the Samsung Galaxy A15 4G are from Mediatek. In the comparison of the Samsung Galaxy A14 4G it has Octa-Core Helio G99 Applications/Baseband Processor (MT6789V-CD), Power Management (MT6366MW), and RF Transceiver (MT6186MV) chips.
Deep Dive Teardown of the Meridian Kia EV6 Audio Amplifier 96370-CV100 Automotive
The Meridian 96370-CV100 is a high-end audio 11 Cannel Amplifier that was designed Meridian Audio. This system is available in the KIA EV6. Communication between the audio amplifier and the audio elements in the car happens through one main connector.
Deep Dive Teardown of the Denso Toyota Prius Front Windshield Camera 8646C-47130 Automotive Camera
Designed by Denso, the Vision Sensor Camera is a part of the Toyota Prius safety and driver assistance system. It combines a millimeter-wave radar sensor and vision sensor to assist the driver in safely controlling the vehicle.
Deep Dive Teardown of the Xiaomi Redmi Note 13 Pro 2312CRAD3C Smartphone
Released in September 2023, the Xiaomi Redmi Note 13 has been equipped with Qualcomm’s Octa-Core Snapdragon 7s Gen 2 Applications/Baseband Processor # SM7435-100-AB, made in 4nm technology. Memory was provided by Micron and contains 12 GB Mobile LPDDR5 SDRAM and 512 GB 3D TLC NAND Flash.
STMicroelectronics Ouster L3 Chip Third-Generation Direct Time-of-Flight CMOS Image Sensor Device Essentials Plus
The Ouster OS1 Mid-Range High-Resolution Imaging LiDAR incorporates the new REV7 sensor that uses the L3 Digital LiDAR Chip. This L3 chip is a stacked back-illuminated (BI) direct time-of-flight (d-ToF) fabricated by STMicrolectronics. The L3 chip uses single photo avalanche diode (SPAD) pixels to analyze the IR signal that is returned to the LiDAR from the emitting source located in the LiDAR.
YMTC 1.33Tb 128L QLC 3D NAND Internal Waveform Overview
The following is an Internal Waveform Overview containing the program, read, and erase waveforms for the YMTC 1.33 Tb 128L quad-level-cell (QLC) 3D NAND flash memory device (die markings: CEC1A). This device is packaged inside the YMTC YMC4G0W1TbG1AA1C0 NAND flash memory package, which was found on the HikSemi HS-SSD-V300 2.5 inch SATA 6 Gb/s 512 GB solid state drive (SSD).
Smartphone On-Device AI Chip Market Share Tracker Q4 2023: Mobile AI Becomes Table Stakes
Global smartphone apps processors (AP) with on-device artificial intelligence (AI) increased 26 percent year-over-year in Q4 2023 as the mobile chip industry rebounds from a market slump. Qualcomm's and Apple APs continue to dominate the absolute volume of on-device AI designs in Q4 2023 with MediaTek making significant gains with their latest Dimensity 9300.
Deep Dive Teardown of the TiVo Stream 4K IPA1104HDW-01 Streaming Media Stick
Several manufacturers share design Wins for the TiVo Stream 4K IPA1104HDW-01. The main SoC came from Amlogic. For this device, Nanya supplied 2 GB LPDDR4 SDRAM. Whereas NAND memory comes from Samsung and offers 8 GB MLC NAND Flash.