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Avago FH513-4KN4 Power Amplifier Die (AFEM-8234) RFIC Process Analysis
The FH513_4KN4 RF power amplifier die was extracted from the Avago AFEM-8234 MHB L-PAMiD RFFE module. This RFIC process analysis (RFP) was performed on samples removed from the Apple iPhone 15 Pro 5G smartphone (A2848) smartphone.
Sensors Market Update CY2023
This presentation provides an overview of the Sensor Market and covers the market and vendor highlights for Smartphone Image Sensors, Smartphone Fingerprint Sensors and Automotive Image Sensors in 2023.
Tracker: Global 5G Smartphone Vendor Market Share by Region: Q1 2024
Apple still barely holds peak position before Samsung. Samsung grew nearly even with Apple this quarter. Emerging markets grew fastest as developed markets have saturated. Top three vendors take nearly two thirds of the shipments. Western Europe was only region to see YoY decline.
IDM and Foundry: Sales, Capex, and Capacity Highlights Report
This report contains highlights from the full data file. A sampling of Integrated Device Manufacturers (IDMs) and foundries important to the automotive industry shows wafer capacity expanded by 9% on average in 2023 after large capital expenditures for fabs since 2020.
Tracker: Global Wearables Revenue and ASP by Vendor 2023 Q4
Global wearable revenues fell by 4% in Q4 2023 as macroeconomic weakness and geopolitical uncertainty caused lengthening replacement cycles and shrinking volumes for both smartwatches and fitness bands.
Main Data Tables - Automotive Electronics System Demand Forecast 2022 to 2031
This market forecast highlights the impact that vehicle architecture change and electrification are having on automotive electronics system demand. Key changes in this update include a substantial upgrade to the forecast model for new vehicle architectures, with High Performance Compute Platforms now included.
Apple Watch Shipments by Model : Q4 2016 to Q1 2024
Apple Watch shipment volumes shrunk by 11% YoY in Q1 2024 largely due to a continued unfavorable YoY comparison - during the 2022 holiday season the Ultra was brand new to the lineup and the SE 2nd gen was launched. In the 2023 holiday season, the SE line was not updated, and while the Ultra was updated, it was no longer a brand-new product line and also has a longer replacement cycle being a higher priced device.
Global Smartphone Top 100+ Microvendors Market Share: Q1 2024
A huge number of second-tier MICROVENDORS were playing a meaningful role in the global smartphone market. However, industry consolidation is underway and major players are taking more shares from small vendors recent years.
Optical Fiber Communications (OFC) 2024: The Year of the AI Data Center
TechInsights previously published a short, complementary report on the main theme of the 2024 Optical Fiber Communications conference (OFC): the “iron triangle” of data rate, delay and power+thermal demands that Artificial intelligence (AI) distributed computing places on data center networking and interconnect.
IDM and Foundry Sales, Capacity, Capex
A sampling of Integrated Device Manufacturers (IDMs) and Foundries important to the automotive industry shows wafer capacity expanded by 9% on average in 2023 after large capital expenditures for fabs since 2020. Several IDMs increased fab capacities in 2023 well above 9% include Samsung, Texas Instruments, Rohm, Infineon, and Microchip.
SK hynix Hi-5021Q Process Flow Analysis
Process flow analysis of the SK hynix Hi-5021Q, a 50 MP 0.70 µm pixel pitch CMOS image sensor. This is the first 0.70 µm pixel from SK hynix analyzed by TechInsights, and it uses the first high-volume production, commercially available image sensor with innovating air gap grid.
Research Bulletin – Top-50 Semiconductor Supplier Marketshare Climbs to 90% in 2023
The top‑50 semiconductor suppliers accounted for 90% of the $559.1 billion global semiconductor market last year, an increase of four points from 86% in 2022.
Qualcomm QTM565 FR2 Antenna in Package (AiP) Packaging Analysis
The Qualcomm QTM565 antenna in package (AiP) is a 5th generation 5G mmWave antenna solution for mobile handsets. It features simultaneous transmit/receive front-end die and power management functions. The physical packaging of the QTM565 is similar to its predecessor the QTM545, with a central printed wiring board (PWB) hosting the dies and the antenna elements comprising separate laminate blocks.
Q1 2024: Apple: Underperformed With Sluggish Demand In Developed Markets
Apple iPhone shipments declined 11% YoY to reach 49.2 million units and 17% market share slipping to second spot in global smartphone market in Q1 2024. One key reason for decline is slowdown in China given Huawei’s growth in the country as well as the restriction from Chinese government limiting use of iPhones by government officials. Moreover, not just China, iPhone shipments declined in most of the regions amid lengthening replacement cycle.
India Smartphone Vendor and OS Market Share: Q1 2024
India smartphone market grew by 10% annually but declined by -11% sequentially in Q1 2024. A double-digit annual growth in the first quarter of 2024 itself augurs well for the whole year. Xiaomi, Vivo and Samsung were the top three smartphone vendors in the quarter.
Qualcomm SDR875-004 Converged RF Transceiver LNA Block RFIC Process Analysis
The HG11-13972-2 RF transceiver die from the Qualcomm SDR875-004 RF transceiver was removed from the Samsung S24 Ultra 5G smartphone (SM-S928W).
North America Smartphone Vendor & OS Market Share by Country: Q1 2024
Growth in the North American smartphone market declined in Q1 2024, the seventh quarter in a row of negative annualized growth for the region. Six of the Top-10 brands recorded negative annual shipment growth. Apple was the Number 1 smartphone vendor in the quarter by units shipped and Samsung led in Android.
Broadcom BCM88920 StrataDNX™ Ramon3 51.2Tb/s Fabric Element BGA Exploratory Packaging Report
The Broadcom BCM88920 StrataDNX™ Ramon3 is telecommunications industry switch gear packaged in a flip-chip ball grid array (FC-BGA) style package. It has a large footprint with over 9,000 package connections and a very low die-to-package ratio. This report presents detailed delayering of the organic substrate supporting the chip, as well as die photographs and analysis.
Deep Dive Teardown of the Huawei Freeclip T0017C Wireless Earbuds
Several manufacturers share the design wins for the Huawei FreeClip wireless earbuds. The Bluetooth 5.3 SoC is supplied by WuQi. Maxscend provided BLE Voice Remote Control. ConvinientPower supplied the High Efficiency Wireless Power Receiver. SOUTHCHIP provided charging chips.
Sony 1.8MP 1.5μm Pixel Eye Tracking Camera from Apple Vision Pro Device Essentials
The Sony IR Eye Tracking Camera CMOS image sensor (CIS) was extracted from the Apple Vision Pro Headset (A2117). The Sony CIS is a 1.8 MP, monochrome, 1.5 μm, stacked back-illuminated (BI) electronic rolling shutter utilizing Exmor RS technology.
Samsung GM5 ISOCELL 2.0 Standard Floorplan Analysis
The ISP die from the Samsung S5KGM5SX, a rear periscope-telephoto camera module that was extracted from the Google Pixel 7 Pro smartphone. The camera module measures 29.6 mm × 14.4 mm × 6.8 mm thick. It contains a stacked imager comprising a CIS die and an ISP die.
Survey Plus Teardown of the Xiaomi Redmi A3 23129RN51H Smartphone
The Xiaomi Redmi A3 has a 90Hz, 6.71-inch IPS LCD display with a resolution of 720 x 1650. The Redmi A3 has three cameras. The main one is an 8 MP Wide-Angle Rear Camera with an image sensor made by SmartSens, the second one is 0.08 MP QVGA Rear Camera with an image sensor made by SmartSens, and the last one is a 5 MP Wide-Angle Front Camera with an image sensor made by SmartSens. The device supports 10 W wired charging.
OECD Mobile Voice and Data Price Benchmarking
The Q1 2024 update of the OECD Mobile Voice and Data Price Benchmarking service is now available for download and includes over 2,100 mobile voice and data tariff plans from 76 providers across 38 OECD countries.
OmniVision 0V50H 50MP 1.2 μm Pixel PureCel Plus-S CMOS Image Sensor Device Essentials Folder
OmniVision 0V50H 50MP 1.2 μm Pixel PureCel Plus-S CMOS Image Sensor Device Essentials Folder
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The OmniVision OV50H CMOS image sensor (CIS) was extracted from the Xiaomi 14 Pro rear camera, which
CXMT CXDB6CCDM-MA G3 8Gb LPDDR4X Memory Floorplan Analysis
The CXMT CXDB6CCDM-MA die was found inside CXMT CXDB6CCDM-MA LPDDR4X DRAM package.
Automotive Sensor Demand Forecast 2022 to 2031 - April 2024
This market forecast for automotive sensors in light-duty vehicles shows that the packaged sensor market is now expected to grow at a CAAGR of 3.8% over 2023 to 2028.
Forecast: Global Smartphone Sales by Biometric Authentication Enablers up to 2029
Biometric Authentication are systems that rely on the unique biological characteristics of individuals to verify identity for secure access.
Report Overview: 2024 Lidar Market Update
As we navigate through the dynamic landscape of the lidar market, characterized by technological innovation, regulatory challenges, and shifting industry dynamics, it becomes critical for stakeholders to remain agile and adaptive.
Automotive Semiconductor Market Shares 2023
Automotive semiconductors grew to 12% of total semiconductor sales in 2023, up from 10% in 2022.
Q1 2024: Samsung: Record-High Smartphone ASP
Samsung shipped 60.0 million smartphones globally in Q1 2024, down 2% YoY, blaming the intensified competition in emerging markets such as Asia Pacific and Central & Latin America.
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