Latest Reports and Analysis
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Deep Dive Teardown of the Amazon Kindle Scribe C4A6T4 E-book Reader
The Amazon Kindle Scribe is a new device that combines the features of an e-reader and a digital notebook.
TechInsights’ Critical Subsystems – Driving Forces Update
Critical Subsystems showed signs of improvement as 3Q23 data came in which upgraded our full year expectations. This report accompanies the full CSUBs Driving Forces update for December 2023.
OnMicro OM9902-11 Phase 5N Power Amplifier Mod (102F PA die) Cct Report (RFFC)
OnMicro 102F Power Amplifier die from the OnMicro OM9902-11 Phase 5N Power Amplifier Module found on the Honor 60 Pro (TNA-AN00)
Q3 2023: HMD (Nokia): Lowest Smartphone ASP in Past Two Years
In Q3 2023, HMD’s worldwide handset shipment dropped marginally by 1% YoY. Handset ASPs decreased annually for the first time in the past nine quarters, and smartphone ASPs fell to the lowest point in two years in Q3 2023, making it difficult for Nokia to position itself as a premium mid-tier brand.
Apple A16 Bionic 4nm Processor Process Flow (Full) Analysis
This report provides a Synopsys 3D emulation analysis of the process flow and integration used in the manufacture of the Apple A16 Bionic SoC, built in TSMC's N4 technology. The emulation includes SPX output files that can be used as input into other Synopsys models.
GigaDevice GDP1BFLM DDR3L SDRAM Memory Floorplan Analysis
This is a Memory Floorplan Analysis (MFR) of the GigaDevice HUANGSHAN4G found inside the GigaDevice GDP1FLM DDR3L SDRAM ball grid array package. The GDP1FLM was extracted from the Milianke MLK-CA03 FPGA development board.
Survey Plus Teardown of the Apple iPhone 15 A3092 Smartphone
The iPhone 15 A3092 features 64-bit ARM based Apple A16 Bionic Applications Processor APL1W10, which is built on a TSMC 4nm process node and an updated version of A15 Bionic. Additionally, A3092 also comes with Qualcomm’s Baseband Processor SDX70M-000.
Deep Dive Teardown of the Samsung Galaxy Tab S9 Ultra SM-X910 Tablet
The Samsung Galaxy Tab S9 Ultra SM-X910 is one of the latest models in Samsung’s flagship Tab S series. The Tab S9 Ultra features a new generation processor (Snapdragon 8 Gen 2), a new Bluetooth standard (5.3), and WiFi6E with extended spectrum like Samsung Galaxy Tab S9+ 5G SM-X816B.
AMD EPYC 9654 100-000000789 Genoa Server TSMC N6 FinFET Process Digital Floorplan Analysis
This is a Digital Floorplan Analysis (DFR) of the I/O die with AMD 2021 die markings found inside the AMD EPYC 9654 100-000000789 Genoa Server, which launched on November 10, 2022.
Baseband Market Share Tracker Q3 2023
The global cellular baseband processor market grew 2% year-on-year (volume shipments) in Q3 2023 as the industry finally enters recovery territory. Major baseband vendors are now looking to grow non-handset growth opportunities as smartphone volumes stagnate.
Murata SS3616043 mmWave Antenna Module Transceiver Floorplan Analysis (RFTF)
The Murata SS3616043 is a millimeter-wave antenna module transceiver discovered in the Google Pixel 8 Pro. This Basic Floorplan Analysis focused on examining the fundamental characteristics of the antenna module. These included determining the minimum metal pitch, the minimum contacted gate pitch, the total number of metal layers, and the specific process technology used.
Connected TV Devices Q3 2023 Market Update
This report complements and discusses the recently published Q3 2023 data reports focused on Smart TV, Game Console, Digital Media Streamer, and Smart Blu-ray Player devices.
Toshiba TH58LKT3V46BA8S 162L 1Tb TLC 3D NAND Memory Floorplan Analysis
The KIOXIA/Western Digital 162-Layer (BiCS6) 3D NAND was developed in 2021. Significant differences with 112-Layer technology include lateral scaling advancement and circuit under array CMOS placement. This report presents a Memory Floorplan Analysis of the KIOXIA FXZ0_1T die found inside the Toshiba TH58LKT3V46BA8S package. The TH58LKT3V46BA8S was extracted from the DapuStor HaiShen5 7.68 TB H5100 SSD.
Survey Plus Teardown of the Samsung Galaxy A05s SM-A057F/DS Smartphone
The Samsung Galaxy A05s SM-A057F saved on the Application/Baseband processor, using the Snapdragon 680, which is over $47 less than other application/baseband processors on average. Even though this is a Survey Plus Teardown, which does not include mechanical costs for the phone or the subsystem, it is unlikely the Galaxy A05s total subsystem prices exceed $146 to match the average total price of other mobile phones.
Deep Dive Teardown of the Fibocom FG650-CN Wireless Module
The FibocomFG650-CN is an IoT module that supports 5G connectivity in two network architectures: 5G independent networking (SA) and 5G non-standalone networking (NSA). It also supports LTE and WCDMA communications. This module is specially designed for China.
Deep Dive Teardown of the Amazon Fire TV Soundbar EVG487 Smart Speaker
Several manufacturers share design wins in the Amazon Fire TV Soundbar EVG487. The audio Processor with memory was supplied by SunPlus, Texas Instruments supplied the 23 W Stereo Class-D audio amplifiers, 1 A Synchronous Buck Converter, and 3 A Step-Down DC-DC Converter. ESMT provided the EN25QH32B 4 MB serial flash memory.
China: Smartphone Shipments & Marketshare by Model: Q3 2023
China is the world's largest smartphone market. It delivers high volume and revenue to device makers, component suppliers and operators. Our extensive report shows the top-100 best-selling smartphone models in China in the third quarter of 2023.
Samsung K9DYGY8J5B-CCK0 236-Layers 3D NAND Flash Memory Floorplan Analysis
Ten months after Samsung’s 236-Layer (V8) TLC Vertical NAND (V-NAND) mass production milestone in November 2022, the 4 TB SSD 990 PRO is announced, in September 2023. This report presents a Memory Floorplan Analysis of the Samsung K9AKGD8J0B die found inside the Samsung K9DYGY8J5B-CCK0 package. The K9DYGY8J5B-CCK0 was extracted from the Samsung MZ-V9P4T0 990 PRO 4 TB SSD.
Deep Dive Teardown of the Google Pixel 8 Pro GC3VE Smartphone
The Google Pixel 8 Pro launched in 2023. It was announced on October 4, 2023, and was available on October 12, 2023. The GC3VE model is suitable for European and Indian markets. The Google Pixel 8 Pro has several improvements regarding its cameras compared to its predecessor.
Deep Dive Teardown of the Kioxia XD6 KXD6CRJJ3T84 SSD
The memory: non-volatile, logic, substrates and memory: volatile category had the greatest impact on the total estimated constructions cost. The cost of each category consists of: -memory: non-volatile ($190.74 –8x 512 GB 3D TLC NAND Flash), -logic ($12.04 –NVMeSSD controller), -substrates ($5.29 –main board), -memory: volatile ($6.54 –2 GB LPDDR4 SDRAM).
Autonomous Vehicles and Sensors Market Scenarios Comparison
This annual update to TechInsights Autonomous Vehicles and Sensors Market Scenarios sees a boost for the expected penetration of L3 vehicles, but a small delay to the predicted adoption of fully autonomous L4 solutions.
3Q 2023 Smartphone AP Market Tracker
The global smartphone applications processor (AP) market gained 2% year-on-year in unit growth during Q3 2023 hinting at the anticipated industry recovery. The smartphone market received a seasonal boost from the latest Apple iPhone 15 series release.
Consumer Electronics Industry Revenues to Exceed $1 Trillion in 2024
Global consumer electronics market revenues are set to break through the one trillion dollar barrier in 2024. This is a significant milestone for the industry and comes at a time of pivotal change and innovation.
OECD Fixed Broadband Price Benchmarking Q3 2023
The Q3 2023 update of the OECD Fixed Broadband Price Benchmarking service is now available for download and includes over 2,600 fixed broadband tariff plans from more than 120 providers across 38 OECD countries.
Sony IMX591, 0.01MP Resolution, 10.1μm Pixel Pitch, Stacked Back-Illuminated Direct-Time of Flight (d-ToF) SPAD Sensor (iPhone 15 Pro Max LIDAR) Device Essentials Plus
This is a Device Essentials Plus (DEP) analysis of the IMX591, 0.01 MP resolution, 10.1 µm pixel pitch, stacked back-illuminated direct-time of flight (d-ToF) SPAD sensor from Apple iPhone 15 Pro/Pro Max LiDAR camera.
Qorvo QM35725 UWB SoC (D1QM3572003 die) Floorplan Analysis (IoTB)
The Qorvo QM35725 is an Ultra-Wideband (UWB) SoC that has been found in Google GC3VE (Pixel 8 Pro).
Sony ISP from IMX591, 10.1μm Pixel Pitch, 0.01MP, Stacked Back-Illuminated Direct-Time of Flight (d-ToF) SPAD Sensor Advanced Floorplan Analysis
The Sony IMX591 is a Time-of-Flight (ToF) sensor used in the LiDAR scanner of the iPhone 15 Pro and Pro Max. The sensor has a resolution of 0.01 megapixels and a pixel pitch of 10.1 microns. The IMX591 die incorporates inverted pyramid structures on the rear side of the CIS active Si, as well as tungsten (W)-filled full depth back deep trench isolation (B-DTI) and composite metal grid (CMG).
UX Benchmark: 23MY Range Rover Sport
TechInsights conducted an evaluation of the infotainment system in the 23MY Range Rover Sport. Land Rover have been striving to add a touch of modernity to their luxury SUV brand image.
Deep Dive Teardown of the Roku Streaming Stick 4K+ 2821R2 Streaming Media Stick
Several manufacturers share design Wins for the Roku Streaming Stick 4K+ 3821R2. The main SoC came from Realtek. For this device, Samsung supplied 1 GB LPDDR4 SDRAM. Whereas NAND memory comes from Kioxia and offers 4 GB MLC NAND Flash. Connectivity is supported by Realtek WiFi/BT transceivers.
Maxscend MXD9122C 5G NR RxD FEM IPD Band Pass Filter Die Process Analysis
This report contains the results of the process and circuit analysis of the integrated passive device (IPD) filter die from the Maxscend MXD9122C 5G NR diversity receive (RxD) front end module (FEM). Maxscend Microelectronics Company Limited operates as an electrical component manufacturing company.
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