The KIOXIA/Western Digital 162-Layer (BiCS6) 3D NAND was developed in 2021. Significant differences with 112-Layer technology include lateral scaling advancement and circuit under array CMOS placement. This report presents a Memory Floorplan Analysis of the KIOXIA FXZ0_1T die found inside the Toshiba TH58LKT3V46BA8S package. The TH58LKT3V46BA8S was extracted from the DapuStor HaiShen5 7.68 TB H5100 SSD.
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