Latest Reports and Analysis
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Broadcom BCM67263 Wi-Fi 7 Access Point SoC Floorplan Analysis (IoTB)
This is a Basic Floorplan Analysis (BFR) of the Broadcom BCM6717 RF transceiver die found inside Broadcom BCM67263 and BCM6726 components. Both Broadcom BCM67263 and BCM6726 components are 4x4 IEEE 802.11be Wi-Fi 7 MAC/PHY/radio system-on-a-chip (SoC) devices with Multi-Link Operation (MLO) in addition to multi-user technologies such as OFDMA (downlink and uplink) and MU-MIMO (downlink and uplink).
Unknown Manufacturer S111341A High-band/Mid-band Front End Module Packaging Analysis (RFPK)
The S111341A high-band/mid-band front end module was found in Huawei's Mate 60 Pro mobile handset, which also features SMIC’s first 7nm device. The module contains eight active dies and 65 other passive devices.
Global Top-500 Smartphone Shipments, ASP, and Price Band by Model with Specs – Q3 2023
This highly detailed report shows the top-500 best-selling smartphone models globally in terms of their shipments, wholesale ASP, and price band in the third quarter of 2023.
CES Show 2024 Report
CES was back in full force this year following a pandemic induced virtual CES in 2021, a reduced event with 45,000 participants in 2022, and a confident return with 115,000 visitors a year ago, this 2024 show boasted more than 130,000 attendees and over 4,000 exhibitors from more than 150 countries and regions, including over 1,200 startups. In this report, we explore the key product and strategic trends in TV display and OS, on-device AI, gaming, VR, and audio.
Apple MacBook Pro M3 14” Sunwoda-Amperex Technology Limited A2519 Laptop Battery Characterization Supplementary Report
The Apple MacBook Pro 14", as an important market-leading laptop computer, is powered by six Sunwoda-ATL battery cells connected in 3S2P configuration. This device was analyzed due to its high interest in Apple products and its unique battery configuration.
CES 2024: ADAS and AV Semiconductor Vendor Roundup
CES remains the premier North American trade show to showcases the CASE (Connected, Autonomous, Shared and Electrified) trends in the automotive market. This report highlights the key developments and announcements from semiconductor vendors including Mobileye, NVIDIA and Qualcomm that showcased processing technology, software and AI technology development for Advanced Driver Assist Systems (ADAS) and Autonomous Vehicle (AV) technologies.
Overviews of Automaker Semiconductor Strategies
Overview of automotive OEM semiconductor strategies including key relationships, EV and Infotainment initiatives and priorities, ADAS and Autonomous initiatives and priorities. Currently covers 11 vehicle OEMs (adding more in the future) in presentation format.
Value Share: Global Smartphone Vendor ASP and Revenue Share by region: Q3 2023
Global smartphone industry revenues marginally grew by 1% in Q3 2023. Apple, Samsung and Xiaomi were the top three vendors and together accounted for 71% of the revenues. Apple was the leading vendor by revenues in all of the six regions tracked.
Samsung S24: Age of Galaxy AI
Samsung announced its latest flagship Galaxy S24 series including S24, S24+, and S24 Ultra on Jan 17th, 2024 in San Jose, USA. Upgraded chipsets and AI-integrated software features will help S24 family defend the premium phone market. Can S24 series outsell their predecessors, amid gloomy global economy and intensified competition from other vendors?
Embedded WLAN (Wi-Fi) CE Device Global Market Analysis
This report complements and discusses the recently published Global Wi-Fi report focusing on various CE Device products including Smartphones, Mobile PCs and Tablets, Smart TVs, Game Consoles, Digital Media Streamers, Wireless Speakers, and more.
Western European Connected TV Market Q3 2023
While the growth of advanced display TVs remains a long-term trend, the current cost-of-living crisis, particularly acute in Western Europe, is limiting its development in Q3 2023, as brands compete on the cheaper end of the market. This report examines the impact of these and other factors on connected TV devices and the TV OS market in Western Europe.
Toshiba TH58LKT2V46BA8S 162L 512Gb TLC 3D NAND Memory Floorplan Analysis
This is a Memory Floorplan Analysis (MFR) of the DapuStor FXZ5_512G die found inside the Toshiba TH58LKT2V46BA8S. The TH58LKT2V46BA8S was extracted from the DapuStor HaiShen5 3.2 TB H5300 SSD.
Analysis: Smartphone Image Sensor Market Forecast 2024–2029
The global market for smartphone image sensors (CIS) is projected to surpass US$ 20 billion in revenues by CY2029, experiencing growth at a CAGR exceeding 5% in five years. This report provides an analysis of the market data report “Smartphone Image Sensor Market Forecast 2024–2029: Recovery in CIS Demand to Steer Revenue Growth”.
NXP SN200 (200VB111) GlobalFoundries 40nm 2Mb eFlash Process Flow Analysis
This report provides an analysis of the process flow and integration used in the manufacture of the NXP SN200 (200VB111) NFC, built in GlobalFoundries 40nm eFlash process technology. The spreadsheet lists the hundreds of process flow steps required in its manufacture.
Automotive Semiconductor Supplier and OEM Relationships
Matrix of relationships between Automotive OEMs and semiconductor suppliers based on our research. Covers 16 OEMs and 14 semiconductor suppliers with details on type of relationship if known.
Issues Impacting the Semiconductor Industry
Qualitative information about issues that may impact the semiconductor industry / supply chain. Includes macro events, geopolitical, materials, etc.
GaN’s Role in Transforming the Power Electronics Landscape
Although at the early stage of market development, GaN is set to take the traditional Si-based power device market by storm over the medium-to-long term, beginning with the low-to-medium voltage application segment.
Google Tensor G3 System-on-Chip Samsung Fanout Panel Level Packaging Advanced Packaging Quick Look
The Tensor G3 chipset powers Google’s top of the line mobile handsets, the Pixel 8 family. Manufactured in a package-on-package (PoP) configuration, the Tensor G3 bottom package is paired with a Micron LPDDR5 top package.
Smartphone Image Sensor Market Forecast 2024-2029: Recovery in CIS Demand to Steer Revenue Growth
The global market for smartphone image sensors (CIS) is projected to surpass US$ 20 Billion in revenues by CY2029, experiencing growth at a CAGR exceeding 5 percent in five years.
China: Cockpit Domain Controller Update – Market Situation, Key Players, and Major Trends
This report focuses on the development and deployment progress of the cockpit computing platform in the Chinese market in the evolution from the separate functional domain to cross-domain integration.
Forecast: Public Cloud Processors, Accelerators, and Memory
This Excel spreadsheet contains forecasts for the installed base, value, and shipments of public cloud processors, accelerators, and memory for the next five years. Cloud providers will face a growing need for processors to keep up with the increasing demand for computational power.
Massive AI Growth Overshadows Automotive Gains at Marvell
Prior to the latest Marvell Analyst Summit, the company reported financial results showing significant growth in its enterprise data center business driven by demand for artificial intelligence and cloud-based applications.
ANALYSIS: Global 5G and mmWave Smartphone Shipments Forecast by Region to 2024
Global 5G smartphone shipments growth will remain low in 2023 due to economic turbulence. Growth is stagnating due to Chinese softness and geopolitical and economic turbulence. Apple leads vendors with nearly a one third share of all 5G shipments globally, followed by Samsung and Xiaomi.
Innovium IVM77310 Teralynx 7 Data Center Ethernet Switch TSMC 16nm FinFET Process Digital Floorplan Analysis
This report provides an analysis of the floorplan design used in the Innovium TERALYNX 7 Data Center Ethernet Switch and includes an executive summary and supporting image sets SEM cross sectional and bevel imaging sets.
Automotive Semiconductor and Sensor Demand Forecast
History and forecast for automotive semiconductors and sensors demand. Includes data from 2015 to 2030 by domain and device type. Also incudes an xEV powertrain semiconductor demand forecast.
Winbond W63AH2NBVABE 25nm LPDDR3 1Gb Memory Floorplan Analysis
This is a Memory Floorplan Analysis (MFR) of the Winbond LPDDR3 SIRIUS D2D3 die with a memory capacity of 1 Gb and a 25 nm generation node. The memory arrays with array peripheral takes about 52% of the die area.
Solidigm 29F02P2BMCQLI 192L 1.33Tb QLC 3D NAND Flash Process Flow Analysis
This report provides an analysis of the process flow and integration used in the manufacture of Solidigm 192L QLC 3D NAND Flash.
Qualcomm SDR753-001 RF Transceiver Floorplan Analysis (RFTF)
The Qualcomm SDR753 is an RF transceiver found inside the Xiaomi 14 Pro. This Basic Floorplan Analysis concentrated on the essential characteristics of the radio frequency (RF) transceiver.
Global Smartphone Installed Base Forecast by Operating Systems for 88 Countries – 2007 to 2028
TechInsights' WSS channel forecasts the growth rate of global smartphone installed base will slow down to 2% YoY in 2024. The factors behind the lowered growth rate include the softened recovery of China and India, the continued geopolitical tensions, and the lasting macroeconomic headwinds through 2023.
CXMT CXDBCCCDM-MA LPDDR4X DRAM Memory Floorplan Analysis
The CXDBCCCDM-MA was extracted from the Xiaomi REDMI 12 5G smartphone. This report presents a Memory Floorplan Analysis (MFR) of the CXMT CXDBCCCDM-MA die found inside CXMT CXDBCCCDM-MA package.
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