Toshiba TH58LKT2V46BA8S 162L 512Gb TLC 3D NAND Memory Floorplan Analysis
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This is a Memory Floorplan Analysis (MFR) of the DapuStor FXZ5_512G die found inside the Toshiba TH58LKT2V46BA8S. The TH58LKT2V46BA8S was extracted from the DapuStor HaiShen5 3.2 TB H5300 SSD. The DapuStor HaiShen5 3.2 TB H5300 SSD contains one SSD controller package, five DRAM packages and eight NAND packages. The TH58LKT2V46BA8S package is 13.5 mm × 11.5 mm × 0.9 mm thick, including solder balls. The 154 solder balls are placed with a pitch of 0.8 mm. There are eight dies within one package. The dies are shingle stacked in two stacks (side by side) of four dies. The dies are connected to the printed wiring board (PWB) via bonding wires on opposite ends.
