Latest Blogs and Commentary
ST Tightens MCU Security
The STM32H5 family updates STMicroelectronics’ high-performance-MCU line with additional security. Installing the new Secure Manager software on the flagship model can yield a complete security suite with no required coding.
Marvell Adds Fusion Models to Octeon 10
Octeon 10 Fusion combines Arm Neoverse N2 CPUs, packet-processing hardware, DSPs, and in-line wireless accelerators. Targeting 5G infrastructure, it’s the only merchant-market integrated base-station processor for macrocells.
Accelerate your process with TechInsights' Logic Packaging Analytics
Are you finding the SoC and ASIC design challenging and time? It takes tremendous time and effort to build up knowledge of the industry, your competitors, your target market, and the product strategies of various SoCs. You may also need to understand critical competitive product benchmarks to achieve design efficiency and differentiation and to enhance your product's performance while optimizing for cost.
Rising macro uncertainties are impeding the prospects of 2H23 recovery
Rising macro uncertainties are impeding the prospects of 2H23 recovery Andrea Lati Order activity for semiconductor equipment remained steady at 45°. Both chipmakers and equipment suppliers are exercising caution regarding their near-term prospects
Disruptive Event - MediaTek’s Dimensity 1050 chipset AiP
Following up on MediaTek’s strong entry into the 5G mmWave market with their Dimensity 1050 chipset, TechInsights has discovered an innovative mmWave antenna array design in their MT6107O antenna-in-package (AiP) as used in the Moto Edge 2022, model XT2205-3 (Verizon edition), and not previously seen in AiP designs from Qualcomm, Murata, and Apple.
The Chip Insider: Sustainability Panel at SPIE ALP
The Chip Insider® - Insider access to C-Suite issues, written openly about what can not be talked about openly about between suppliers and customers.
Grab your jackets! It's going to be a cold Spring! (March Update)
Grab your jackets! It's going to be a cold Spring! (March Update) Shereen Vaux Order activity for semiconductor equipment slipped to a chilly 45°. There were some notable changes made to our forecasts this month. The February data are in from the
Sustainability Panel at SPIE ALP
Sustainability Panel at SPIE ALP G. Dan Hutcheson The Chip Insider® Sustainability Panel at SPIE ALP: Why me? Which was my first question when they asked me to run this panel. As you know, until recently, I have considered sustainability to be a “boy
TechInsights' Semiconductor Analytics Report
TechInsights' Semiconductor Analytics report
The Chip Insider
25th Anniversary Issue of The Chip Insider. Why China will fail…
Webinar: Minimizing Battery Degradation in Smartphones
This webinar reviews the existing industry fast charging techniques used by Apple, Samsung, and Xiaomi in their recent flagship smartphones. It was observed that these smartphones benefit from adaptive charging algorithms to suppress battery degradation, which would generally result from the high applied current.
Chiplet Technology Advances
Packaging technology goes hand in hand with chiplets. Examples include basic PCB-based 2D structures, passive silicon interposers and bridges for 2.5D packages, 3D packages employing active interposers, and hybrid bonding.
Generative AI on a Phone?
Generative-AI models such as ChatGPT are typically large and run only in the cloud, but Qualcomm recently demonstrated a smaller image-generation model called Stable Diffusion performing inference on a smartphone.
Ceva XC20 Enables Vector-Unit Sharing
The new Ceva XC20 architecture implements simultaneous multithreading in a vector DSP. The first product to use it, the XC22 more than doubles area efficiency compared with Ceva’s previous DSP cores.
25th Anniversary Issue of The Chip Insider. Why China will fail.
25th Anniversary Issue of The Chip Insider. Why China will fail. G. Dan Hutcheson The Chip Insider® 25 Years Ago Today, I started a new e-mailing to subscribers to address the increasing need for instantaneous analysis of events in a time when market
TechInsights' Semiconductor Analytics report
TechInsights' Semiconductor Analytics report
It’s cold out there as we head into Spring
It’s cold out there as we head into Spring Shereen Vaux Order activity for semiconductor equipment slipped a degree to a brisk 45 degrees All segments remain at temperate temperatures, with the exception for Memory which remains at freezing levels
IoT Predictions for 2023
The Mobile channel at TechInsights recently published the annual IoT Predictions for 2023. TechInsights have identified 3 key technology trends and 2 key strategic trends which we expect will shape the IoT market in 2023 and beyond.