Baseband Market Share Tracker Q3 2023

The global cellular baseband processor market grew 2% year-on-year (volume shipments) in Q3 2023 as the industry finally enters recovery territory. Major baseband vendors are now looking to grow non-handset growth opportunities as smartphone volumes stagnate.
20Dec

Murata SS3616043 mmWave Antenna Module Transceiver Floorplan Analysis (RFTF)

The Murata SS3616043 is a millimeter-wave antenna module transceiver discovered in the Google Pixel 8 Pro. This Basic Floorplan Analysis focused on examining the fundamental characteristics of the antenna module. These included determining the minimum metal pitch, the minimum contacted gate pitch, the total number of metal layers, and the specific process technology used.
20Dec

Toshiba TH58LKT3V46BA8S 162L 1Tb TLC 3D NAND Memory Floorplan Analysis

The KIOXIA/Western Digital 162-Layer (BiCS6) 3D NAND was developed in 2021. Significant differences with 112-Layer technology include lateral scaling advancement and circuit under array CMOS placement. This report presents a Memory Floorplan Analysis of the KIOXIA FXZ0_1T die found inside the Toshiba TH58LKT3V46BA8S package. The TH58LKT3V46BA8S was extracted from the DapuStor HaiShen5 7.68 TB H5100 SSD.
20Dec

Survey Plus Teardown of the Samsung Galaxy A05s SM-A057F/DS Smartphone

The Samsung Galaxy A05s SM-A057F saved on the Application/Baseband processor, using the Snapdragon 680, which is over $47 less than other application/baseband processors on average. Even though this is a Survey Plus Teardown, which does not include mechanical costs for the phone or the subsystem, it is unlikely the Galaxy A05s total subsystem prices exceed $146 to match the average total price of other mobile phones.
20Dec

Samsung K9DYGY8J5B-CCK0 236-Layers 3D NAND Flash Memory Floorplan Analysis

Ten months after Samsung’s 236-Layer (V8) TLC Vertical NAND (V-NAND) mass production milestone in November 2022, the 4 TB SSD 990 PRO is announced, in September 2023. This report presents a Memory Floorplan Analysis of the Samsung K9AKGD8J0B die found inside the Samsung K9DYGY8J5B-CCK0 package. The K9DYGY8J5B-CCK0 was extracted from the Samsung MZ-V9P4T0 990 PRO 4 TB SSD.
20Dec