History and forecast for automotive semiconductors and sensors demand. Includes data from 2015 to 2030 by domain and device type. Also incudes an xEV powertrain semiconductor demand forecast.

Last year, the public cloud delivered a colossal 3.9 trillion virtual CPU-hours of computing power, equivalent to a single processor hyperthread operating around the clock for 445 million years. Cloud providers used a minimum of 7.5 million processors to deliver this capability, with a market value of $39 billion, according to TechInsights’ Cloud and Datacenter coverage area.

This is a Memory Floorplan Analysis (MFR) of the Winbond LPDDR3 SIRIUS D2D3 die with a memory capacity of 1 Gb and a 25 nm generation node. The memory arrays with array peripheral takes about 52% of the die area.

This report provides an analysis of the process flow and integration used in the manufacture of Solidigm 192L QLC 3D NAND Flash.

The Qualcomm SDR753 is an RF transceiver found inside the Xiaomi 14 Pro. This Basic Floorplan Analysis concentrated on the essential characteristics of the radio frequency (RF) transceiver.

Discover CES 2024's gaming evolution: handheld PCs, GeForce NOW updates, and insights into the future of gaming. Join the conversation on TechInsights for exclusive analyses and stay ahead in the dynamic gaming landscape.

TechInsights' WSS channel forecasts the growth rate of global smartphone installed base will slow down to 2% YoY in 2024. The factors behind the lowered growth rate include the softened recovery of China and India, the continued geopolitical tensions, and the lasting macroeconomic headwinds through 2023.

The CXDBCCCDM-MA was extracted from the Xiaomi REDMI 12 5G smartphone. This report presents a Memory Floorplan Analysis (MFR) of the CXMT CXDBCCCDM-MA die found inside CXMT CXDBCCCDM-MA package.

The Skyworks 01413025 is an RF Power Tracker module transceiver discovered inside the Google Pixel 8 Pro. This Basic Floorplan Analysis focused on the Antenna Module's fundamental properties. These included determining the minimum metal pitch, the minimum contacted gate pitch, the total number of metal layers, and the process generation used.

This is a Digital Floorplan Analysis (DFR) of the Moore Threads MT_SUD1_102 die found inside the Moore Threads Chunxiao graphics processing unit (GPU) component. The Chunxiao GPU was removed from a Moore Threads MTT S80 graphics card.