Global smartphone shipments grew by 7% annually YoY in Q4 2023. The sixty countries tracked in this report accounted for 91% of these global shipments. Apple was the largest vendor and was followed by Samsung on consolidated shipments to these markets.

AI-capable notebook PCs - defined as a notebook PC that ships with a dedicated chipset built specifically to accelerate AI computing on device (i.e. an NPU) – will represent 95% of the total notebook PC market, or 230.5 million units, shipped in 2029.

This report presents an advanced floorplan analysis of the image signal processor (ISP) die from the Prophesee GenX320ES, 1/5″ format, 320 ×320 pixels resolution, 6.3 μm pixel pitch, stacked back-illuminated event-based Metavision® CMOS image sensor for embedded vision and power-sensitive applications.

This report provides an analysis of the structure and materials used in the manufacture of Beken BK3296 22nm Bluetooth Audio SoC manufactured in UMC's 22nm ULP process. The report includes a summary of key findings, and a detailed look at the FEOL, MOL and BEOL structures and materials used. Extensive SEM, TEM and materials analysis provide a complete look at how this device was manufactured.

Gain exclusive access to TechInsights' comprehensive 3D NAND Technology Roadmap, guiding you through the ever-evolving landscape of innovation.

Stay ahead in the dynamic world of semiconductor technology with insights into the race for maximum NAND capacity per wafer in 3D NAND production. Discover how advancements are driving innovation, pushing boundaries, and shaping the future of storage.

Power Management (PM8550VE-001, PM8550VS-001, and PM8550-001) used in Samsung version S24 Ultra, which indicates the use of the same chipset as flagships smartphones. ICs from Skyworks, Qualcomm and Murata provide RF chips for smartphones. Of the new RF chips, the most notable is the LB Front-End Module (SKY58101-11). OnePlus has WiFi 7 and Bluetooth 5.3, for this used Qualcomm IC (WCN7851-101).

The manufacturer with the main cost is Samsung. It supplied the Applications/Baseband Processor, DDR5X SDRAM, 3D TLC V-NAND Flash, RF Transceiver + GPS, NFC Controller, 8x Power Management, Camera Power Management, 3x Envelope Power Tracker, and Clock Buffer. Samsung supplied a total of 18 chips for this device.

Discover the groundbreaking Blackwell chip, promising accelerated advancements in autonomous driving and electric vehicles with its impressive performance improvements.

This report provides an analysis of the structure and materials used in the manufacture of the of the Intel Core Ultra 7 155H (Meteor Lake) CPU die (compute tile), fabricated using the Intel 4 finFET process. The report includes a summary of key findings, and a detailed look at the FEOL, MOL and BEOL structures and materials used. Extensive SEM, TEM and materials analysis provide a complete look at how this device was manufactured.