Assembly and Test Cost and Price Model
In-depth cost and price model for advanced package types including multi-die applications.
This model caters to a diverse spectrum of clientele, spanning from Integrated Device Manufacturers (IDMs) and fabless semiconductor companies to analysts, consultants, electronic systems firms, automotive enterprises, and beyond.
To understand this evolving landscape, you need a strong industry-leading business analysis tool.
Market Analysis Solutions
End Market Analysis:
The Semiconductor Manufacturing Economics Advantage
These products give any organization unique and detailed insights into the semiconductor supply chain. Customers include the world’s largest IDMs, foundries, fabless, electronics systems, automotive companies, equipment OEMs and materials suppliers, analysts, universities, and start-ups.
Supported Assembly Processes:
Leadframe, organic substrate (such as BGA, PGA, and LGA), ceramic substrate, wafer level, and InFO, including multichip and chiplet packages.
Supported Wafer Size:
75mm, 100mm, 125mm, 150mm, 200mm, and 300mm.
Supported Cost Elements:
Overall wafer sort, assembly and final test cost, assembly and tests processes, plus material usage.
Apple iPhone Air A3260 Teardown: Cost and Component Insights
TechInsights’ teardown of the Apple iPhone Air A3260 reveals 29 new components, a BOM cost 2% higher than Samsung’s S25 Edge, and key cost drivers in silicon and RF.
Get a data-driven view of the technologies, markets, and supply-chain dynamics that will define 2026 and beyond.
AI demand fuels DRAM and NAND shortages, major chip mergers, and new SoC breakthroughs. Read TechInsights’ November Chip Observer for full semiconductor analysis.
The Authoritative Information Platform to the Semiconductor Industry.
