![]()
Strategic Cost and Price Model
Advanced and future semiconductor manufacturing processes model.
This model offers insights into advanced and future semiconductor manufacturing processes, including process specifics, equipment, material sets, detailed requirements, usage guidelines, and costs. It caters to clients such as IDMs, consortia, materials companies, and OEMs involved in market projections and costs, among others.

To understand this evolving landscape, you need a strong industry-leading business analysis tool.
Market Analysis Solutions
End Market Analysis:
The Semiconductor Manufacturing Economics Advantage
These products give any organization unique and detailed insights into the semiconductor supply chain. Customers include the world’s largest IDMs, foundries, fabless, electronics systems, automotive companies, equipment OEMs and materials suppliers, analysts, universities, and start-ups.
Model Covers:
2D and 3D NAND Flash, DRAM, Foundry and IDM Logic, and Silicon Photonics.
Supported Wafer Size:
300mm.
Supported Cost Elements:
300 wafer cost and price only.
Apple iPhone Air A3260 Teardown: Cost and Component Insights
TechInsights’ teardown of the Apple iPhone Air A3260 reveals 29 new components, a BOM cost 2% higher than Samsung’s S25 Edge, and key cost drivers in silicon and RF.
Get a data-driven view of the technologies, markets, and supply-chain dynamics that will define 2026 and beyond.
AI demand fuels DRAM and NAND shortages, major chip mergers, and new SoC breakthroughs. Read TechInsights’ November Chip Observer for full semiconductor analysis.










