Discrete and Power Cost and Price Model
End-to-end cost and price model for high-power silicon ICs and discrete devices, and compound semiconductors.
A self-contained and comprehensive solution model that stands alone, serving various purposes such as benchmarking, price evaluation, and market research, among others. It caters not only to Purchasing Departments but also finds relevance for Integrated Device Manufacturers (IDMs), Original Equipment Manufacturers (OEMs), fabless semiconductor companies, analysts, materials enterprises, consultants, electronics firms, and a wide array of industries. Notably, this model holds particular significance within the automotive sector.
To understand this evolving landscape, you need a strong industry-leading business analysis tool.
Market Analysis Solutions
End Market Analysis:
The Semiconductor Manufacturing Economics Advantage
These products give any organization unique and detailed insights into the semiconductor supply chain. Customers include the world’s largest IDMs, foundries, fabless, electronics systems, automotive companies, equipment OEMs and materials suppliers, analysts, universities, and start-ups.
Supported Assembly Processes:
Over 300 processes by company, voltage, and processes.
Supported Wafer Size:
100mm, 125mm, 150mm, 200mm, and 300mm.
Supported Cost Elements:
Wafer cost, wafer test, packaging and final test on 7 (seven) entries.
The Future of AI: 5 Game-Changing Expectations for 2026 | TechInsights Outlook Summit
5 AI shifts will redefine 2026, join TechInsights to see what’s next. Explore forecasts on AI workloads, semiconductor innovation, and global supply chains shaping the $300B accelerator market.
The new Apple iPhone Air — Apple’s slimmest iPhone yet at 5.62 mm, featuring the A19 Pro processor, N1 connectivity chip, and updated C1X modem. Explore TechInsights’ ongoing analysis of the iPhone Air.
AI Model Trends Q3 2025: Small Models Surge as Total Count Doubles
TechInsights projects over 2.5M AI models in 2025, nearly doubling year-over-year, with small models and multimodal AI driving the next wave of innovation.