Discrete and Power Cost and Price Model
End-to-end cost and price model for high-power silicon ICs and discrete devices, and compound semiconductors.
A self-contained and comprehensive solution model that stands alone, serving various purposes such as benchmarking, price evaluation, and market research, among others. It caters not only to Purchasing Departments but also finds relevance for Integrated Device Manufacturers (IDMs), Original Equipment Manufacturers (OEMs), fabless semiconductor companies, analysts, materials enterprises, consultants, electronics firms, and a wide array of industries. Notably, this model holds particular significance within the automotive sector.
To understand this evolving landscape, you need a strong industry-leading business analysis tool.
Market Analysis Solutions
End Market Analysis:
The Semiconductor Manufacturing Economics Advantage
These products give any organization unique and detailed insights into the semiconductor supply chain. Customers include the world’s largest IDMs, foundries, fabless, electronics systems, automotive companies, equipment OEMs and materials suppliers, analysts, universities, and start-ups.
Supported Assembly Processes:
Over 300 processes by company, voltage, and processes.
Supported Wafer Size:
100mm, 125mm, 150mm, 200mm, and 300mm.
Supported Cost Elements:
Wafer cost, wafer test, packaging and final test on 7 (seven) entries.
Apple iPhone Air A3260 Teardown: Cost and Component Insights
TechInsights’ teardown of the Apple iPhone Air A3260 reveals 29 new components, a BOM cost 2% higher than Samsung’s S25 Edge, and key cost drivers in silicon and RF.
Get a data-driven view of the technologies, markets, and supply-chain dynamics that will define 2026 and beyond.
AI demand fuels DRAM and NAND shortages, major chip mergers, and new SoC breakthroughs. Read TechInsights’ November Chip Observer for full semiconductor analysis.
The Authoritative Information Platform to the Semiconductor Industry.
