Latest Reports and Analysis
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TI LMG3626 650 V 270 mΩ GaN FET with Integrated Driver Power Essentials
Discover the Texas Instruments LMG3626, a 650V 270mΩ GaN power FET.
Insight: US Top 10 Interactive Security Providers
This report is TechInsights’ annual compilation of the Top 10 providers of Interactive residential security services in the US. This year’s list sees Wyze, the low-cost hardware maker, drop out, with Vector Security, Guardian Protection, and CPI Security Systems added to reflect their established home security businesses which have been successfully migrating users to interactive security products and services.
Samsung Exynos W1000 Wearable Processor Samsung SF3 GAA Process – Release 1
This report provides a preliminary analysis of the structure and materials used in the manufacture of of the Samsung Exynos W1000 wearable processor die, fabricated using the SF3 process, Samsung’s second-generation (gate-all-around) GAA process.
HP Omen 16 (2023) (7N9X4UA_ABA) Deep Dive Teardown
HP Omen 16 2023 laptop is released specially for gaming applications, powered by AMD Rayzen 7840H processor and NVIDIA GeForce RTX 40 series graphics processor. Laptop designed with Wi-Fi 6e/Bluetooth 5.3 and 2TB PCIe Gen 4 Samsung SSD.
July McClean Report
The July Update to the McClean Report reviews semiconductor industry capital spending and capacity. Semiconductor fabrication is an exceptionally capital-intensive process.
Does AWS’s new Graviton 4 really deliver on price-performance?
AWS previewed its new Graviton4-based EC2 r8g instances at re:Invent 2023. It is now generally available in four AWS regions. The r8g offer 30% better performance and will be available in large instance sizes with up to 3x more vCPUs (up to 48xl) and memory (up to 1.5TB) than Graviton3-based r7g instances.
Loongson 3A6000 CPU Digital Floorplan Analysis
This CPU contains a quad-core 2.5 GHz LSA664 CPU, four 16 MB L3 cache memory, and two DDR4x memory controller. Look further into this digital floorplan analysis (DFR) to find out the process node, BEOL stack, bit cell usage, and manufacturing cost.
Analysis: Smartphone Display Panel Market Share Q1 2024
The global smartphone display panel market experienced a dip in revenues of over 10% percent year-over-year in Q1 2024. The revenues fell on the back of declining panel ASPs and diminishing LCD market demand that impacted the performance of key display vendors in the period.
Handset Vendor Market Share for 60 Countries: Q1 2024
Global handset shipments grew by 7.5% annually in Q1 2024. The "Sixty" counties tracked in this report accounted for 88% of the handset volumes in the quarter. Samsung, Apple, and Xiaomi were the top three vendors by consolidated shipments to these markets.
Memory Pricing Report – July 2024
This monthly update delves into the dynamic and volatile pricing landscape of mainstream DRAM and NAND memory, offering an examination of pricing trends over the past three months and projecting developments for the upcoming year.
Smart Home Device Shipments to Exceed 2.5 Billion in 2030
This report is an overview of what is included within TechInsights: Smart Home Device Shipments to Exceed 2.5 Billion in 2023.
Tracker: VALUE SHARE: Global Wearables Revenue and ASP by Vendor: 2024 Q1
Global wearable revenues fell by 3% in Q1 2024 as macroeconomic weakness and geopolitical uncertainty caused lengthening replacement cycles and shrinking volumes for both smartwatches and fitness bands. ASPs remain elevated due to persisting inflation as well as product mix trending away from lower priced fitness bands and toward higher priced smartwatches.
Insight: “Apple Intelligence” Attempts to Take Back AI Leadership at WWDC 2024
Despite designing one of the first PC chipsets with a neural processing unit (NPU)—the M-series chip—and shipping millions of devices powered by it, Apple has been dodging questions on its AI strategy for the last year. Meanwhile, companies like Microsoft, Qualcomm, Intel, AMD, and Nvidia have been gleefully showing examples of how AI PCs powered by their silicon and software will change computing.
Power Semiconductor Market Share - 2Q 2023
The Global Power Semiconductor market is estimated to be valued at $52.7 billion in 2023. Infineon are leading the market with an estimated power semiconductor revenue of $9.3 billion in 2023. They are followed by STMicroelectronics and Texas Instruments with $5.8B and $5.2B revenue respectively.
Sony IMX681 Device Essentials Folder
The Ray-Ban Meta Wayfarer Smart Glasses comes with a 12 MP ultrawide-angle camera that captures high-quality photos and videos and a five-mic array audio system that takes audio-rich immersive videos. The camera uses the SONY IMX681, which is a stacked Back-Illuminated (BI) CMOS image sensor (CIS) with 12 MP resolution and 1.00 µm pixel pitch.
Apple M4 SoC Digital Floorplan Analysis
The TMRV93 die was found inside the Apple APL1206 M4 processor. The Apple M4 component was extracted from the Apple iPad Pro released on May 7, 2024. The analysis includes structural analysis, critical dimensions, and layout analysis of digital blocks, along with die utilization calculations, including the total area for logic, I/O, memory, and analog components separately.
STM STH60N099DM9 600 V, 76 mΩ MDmesh DM9 Automotive SJ-MOSFET Power Essentials
As STMicroelectronics’ first automotive device in the new STPOWER MDmesh DM9 AG series, the STH60N099DM9-2AG, announced on March 11, 2024, features an N-channel 600 V Si SJ-MOSFET die which provides a maximum continuous source/drain (S/D) current of 27 A (at T = 25 °C) and a 76 mΩ typical source/drain (S/D) ON-resistance (RDS(ON)) at 10 V VGS bias.
Europe xEV Market Demand Outlook 2022-2031
This report summarizes forecasts for the European market for xEV systems, semiconductors, and sensors. Despite uncertainties such as Ukraine conflict, semiconductor shortages, and a slowing global economy, the momentum towards electrification and battery electric vehicles remains robust, with volume demand continuing to rise.
Qualcomm QCN6402-001 Wi-Fi 7 Transceiver Floorplan Analysis
The Qualcomm HG11-58812-110 was found inside Qualcomm QCN6402-001 Wi-Fi 7 RF transceiver. The QCN6402-001 was extracted from the Xiaomi RD15 Wi-Fi 7 mesh router. This router was launched in retail markets in January 2024.
Qualcomm SDR875 Converged RF Transceiver Packaging Analysis
The SDR875-001 is part of Qualcomm’s Snapdragon 8 Gen 3 mobile platform, and delivers both FR1 and FR2 bandwidth transceiver functions in a single device. This is a new design strategy - previous platforms featured separately packaged transceivers - and this report examines the packaging details in support of the ‘converged’ device.
Winbond WBGAA107X 25 nm 2 Gb LPDDR4X DRAM Memory Floorplan Analysis
The Winbond WBGAA107X die was found inside Winbond W66CQ2NQUAFJ 2 Gb LPDDR4X DRAM package. Winbond is a specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, it is the only company in Taiwan with the ability to develop DRAM and flash products in-house.
Deep Dive Teardown of the Xiaomi E20 WiFi Smart Door Lock
The Xiaomi Smart Door Lock E20 is a Wi-Fi smart lock, designed with fingerprint, password unlock, NFC unlock, Bluetooth 5.0, eight 6V AA batteries, and 5V type-C emergency power.
Battery technology and fitment database - June 2024
This database provides a panoramic view of key battery cell manufacturers worldwide, covering the areas of their product roadmap, manufacturing capacity, relationships with OEMs and non-OEMs, as well as their raw material suppliers.
Research Bulletin – Biden admin awards $504m in CHIPS Act funds
The Regional Technology and Innovation Hubs program aims to spread R&D capabilities throughout the US, expanding beyond Silicon Valley’s orbit.
Insight: AI-Capable Notebook PC Shipment Forecast Q2 24- AI PC Gains Momentum
AI-capable notebook PCs - defined as a notebook PC that ships with a dedicated chipset built specifically to accelerate AI computing on device (i.e. an NPU) – will represent 95% of the total notebook PC market, or 227.3 million units, shipped in 2029.
OmniVision OV50H Device Essentials Plus
This report provides a detailed analysis into the structure of the OmniVision OV50H CIS. The analysis includes structural and material analysis and details of the structural dimensions, which are used to manufacture the image sensor and image signal processor (ISP) and a summary of the salient features observed.
Datacenter Computing Processors Q2 2024
The overall Datacenter Computing Processor market was $29.7 billion in Q1 2024, close to +200% year-over-year (3x), driven by stellar GPU shipments and sustained ASIC demand. The CPU and FPGA markets are bottoming out with accelerated year-over-year growth expected through 2024.
Wearable Battery (Amazon Echo Frames-3rd Gen) Battery Characterization
In addition to the battery essentials report (BEF-2312-801) that recently provided important structural and morphological insights, this report presents a Battery Characterization (BCR) analysis of the Desay 26S1029 Li-ion battery extracted from the Amazon Echo Frames 3rd Generation smart glasses.
Analysis - Smartphone Fingerprint Sensor Market Share Q1 2024
The market for smartphone fingerprint sensors secured over 5% revenue growth in Q1 2024. Qualcomm took the top spot followed by Goodix and Egis Technology in the quarter.
STMicroelectronics VB1940, VD1940 Standard Floorplan Analysis
Insight into the structure of the STMicroelectronics VB1940 CMOS image sensor ISP die for automotive applications, which is a 5.1 MP, 1/2.5” stacked back-illuminated RGB/NIR technology CIS with a pixel pitch of 2.25 µm.
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