Manufacturing Carbon Module

Addressing Semiconductor Carbon Emissions: A Two-Part Challenge

As demands for semiconductor technology continue to increase, so do the impacts of the semiconductor industry on the environment. With the climate crisis intensifying, the semiconductor industry faces a two-part challenge:

• Design greener chips and the associated processes to reduce carbon emissions while simultaneously producing more powerful, and cost-effective semiconductors.
• Reduce carbon emissions from existing manufacturing facilities.

 

Examining Scope 1, 2, and 3 carbon emissions from manufacturing a die, with breakout for Scope 1 emissions. Source: TechInsights’ Manufacturing Carbon Module, 2024.

 

Manufacturing Carbon Module Overview

The Manufacturing Carbon Module calculates Scope 1, 2, and 3 carbon emissions from integrated circuit manufacturing of chips measuring 130nm to 10A, including logic and memory (NAND and DRAM), and known fabs coming online in the next several years. Select silicon carbide (SiC) and gallium nitride (GaN) processes, and associated fabs, are also included. Scope 1 emissions are further broken down by natural gas and individual process gases. Scope 3 emissions cover more than 240 raw materials and chemicals. The Module provides carbon emissions and water consumption from 2015 to 2035, allowing users to compare historical results to current and future scenarios.

The Module makes it possible to review and compare electricity, carbon emissions, and process gases for each piece of equipment used. Equipment categories include atomic layer deposition (ALD), backgrind, chemical vapor deposition (CVP), chemical mechanical polishing (CMP), dry etch, implant, inspection, lithography, metrology, plating, physical vapor deposition (PVD), spin-on, thermal and wet cleans.

Breakdown of Carbon Emissions by Equipment Type from process gas and electricity. Source: TechInsights’ Manufacturing Carbon Module, 2024.

Insights in the Manufacturing Carbon Module include:

• CO2e emissions and water consumption by node at a fab, die, and wafer level
• Emissions at the equipment and process level
• Future emerging technology and electricity mix impact on carbon emissions and water consumption
• Detailed emissions and water consumption for customized fabs as well as fabs currently under construction or planned.

 

Get answers to key questions about semiconductor carbon impacts and how the industry is working to decrease emissions.

 

Supporting Your Business in Its Sustainability Reporting

Covering more than 225 fabs, the TechInsights Manufacturing Carbon Module is a vital sustainability tool providing the detailed modeling and benchmarking that supports many areas of the semiconductor value chain, including:

• Capital Equipment vendors see value with the Module providing a critical business development tool to compare and benchmark tools versus the competition, while also being able to understand the abatement levers that help reduce emissions.
• Foundries can use the editable fields for scenario analysis; and facilitates understanding of abatement on carbon emissions and electricity consumption, as well as run competitor comparisons.
• Fabless Vendors gain a fact-based understanding of die size on carbon emissions, electricity consumption and water use. The Module also enables scenario analysis.
• Integrated Device Manufacturers (IDMs) use the tool to support key design decisions and evaluate investment decisions for new equipment and tools.
• Product Manufacturers use the Manufacturing Carbon Module provides key inputs into cradle-to-grave analysis and reporting.
• Automotive manufacturers use the Manufacturing Carbon Module to understand the carbon emissions associated with electronic components being used in vehicles, in conjunction with costing information from TechInsights’ Strategic Cost and Price Model.

 

Get a free demo and learn more now by speaking with our Sustainability product team.