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YMTC 1Tb 232L QLC 3D NAND Flash Internal Waveform Analysis
The YMTC 1 Tb 232L quad-level-cell (QLC) 3D NAND flash memory device is packaged inside the YMTC YMN0AQF1B1HCAD NAND flash memory package, which was found on the ZhiTai Ti600 M.2 PCIe 4.0 NVMe 1 TB solid state drive (SSD). This Internal Waveform Overview (IWO) analysis provides an overview of the internal voltages required to program, read, and erase the flash memory cells.
Telecom Network Equipment Market Update 2023
The overall telecom equipment market has slowed down in 2023 after few years of consistent growth. Global 2023 telecom equipment revenues have a -5% decline from 2022. As in the past, the total market is highly concentrated among the top few players, in 2023, the top 4 vendors accounted for almost 70% of the global market in 2023.
Tier 1 Vendor Regional Design Center Database
TechInsights has updated its Automotive Electronics Design Center Database, where research and development of automotive electronics systems and components are undertaken by the world’s leading Tier 1 vendors. This database lists 13 new entries and new facilities, and 18 updated existing entries, which also includes centers developing technology in automotive communication, infotainment, telematics and electric vehicle batteries. In total, around 2,500 centers are listed.
VALUE SHARE: Global 5G and LTE Handset Revenue and ASP by Vendor : Q4 2023
Global 5G handset industry revenues and shipments grew double digits in Q4 2023. Apple remains the leader of 5G shipments and revenues, but Samsung is growing behind Apple. Samsung is the world’s second-largest 5G vendor in terms of shipments and revenues. Samsung is the biggest vendor in LTE shipments and revenues.
KIOXIA FXZ5_512G 162L 512 Gb TLC 3D NAND Transistor Characterization
The Toshiba TH58LKT2V46BA8S TLC 3D NAND flash is a 154-ball grid array (BGA), multi-chip package (MCP), measuring 13.5 mm × 11.5 mm × 0.9 mm thick, including solder balls. The TH58LKT2V46BA8S contains eight stacked KIOXIA 162-layer FXZ5 512G dies, arranged in two side by side four die stacks. Bond wires connect the two die stacks to the two wider sides of the printed wiring board (PWB).
Deep Dive Teardown of the Samsung Galaxy S24+ SM-S926NZVEKOO Smartphone
The Samsung Galaxy S24+ is one of Samsung’s flagship S series phones launched at the Galaxy Unpacked event on February 17, 2024. The SM-S926N model is targeted at the Korean market. In the Samsung Galaxy S24+ SM-S926N phone, Samsung provided 15 out of 42 packages in design wins.
Trackers: TV & Video Services
These quarterly reports provide subscriber, revenue, and market share data for subscription video-on-demand (SVOD) services, pay TV operators, online advertisers, video services, gaming services, and music services by vendor.
Report Overview: Wi-Fi 7 Comes to the Automotive Industry
The unveiling of the Wi-Fi 7 certification marks a notable change in automotive connectivity norms. This overview provides insight into the contents of TechInsights' comprehensive report, "Wi-Fi 7 Comes to the Automotive Industry."
India: Automotive Infotainment and Connected Services 2024 Update
Automakers are consistently incorporating additional connectivity, safety, security, and entertainment features to gain a competitive edge and sell more cars. In the pursuit of expanding their market share, connectivity is anticipated to play a role, as more models currently available in the market are equipped with embedded cellular connectivity, particularly top-end models.
Report Overview: Executive Summary Telecom Predictions for 2024
This report is an overview of what is included within TechInsights Executive Summary – Telecom Predictions for 2024 full report. Telecom operators must make important decisions in 2024 amid transformative waves and emerging challenges.
Global Smartphone Monthly Shipments, Sales, and Inventory Variance by Vendor – March 2024
TechInsights tracked global smartphone shipments (sell in) which went up 2% YoY and sales (sell through) went down 1% YoY in February 2024. Although smartphone shipments rebounded, the industry is still suffering from the mixed consumer demand. Samsung gained the top place by shipments and sales from Apple which nudged down to the second position, followed by Xiaomi, vivo, Transsion, etc.
Desay 26S1029 Li-Ion Wearable Battery (Amazon Echo Frames 3rd Gen Smart Glasses) Battery Essentials
This report describes a Battery Essentials (BEF) analysis of the Desay 26S1029 Li-ion battery extracted from the Amazon Echo Frames 3rd generation smart glasses. Powering a wearable device, the 26S1029 battery demonstrates interesting features that are presented in the report.
Exploring the Opportunities for NVIDIA in the Chinese Automotive Market at GTC 2024
This report reviews the latest findings from NVIDIA’s GTC 2024 event and examines the future opportunities for NVIDIA in the Chinese market for the development of next-generation intelligent vehicles.
indie Semiconductor Bolsters its ADAS Portfolio with Investment in AI Processor Vendor Expedera
indie Semiconductor’s investment in Expedera aims to add Expedera’s neural processing unit (NPU) semiconductor intellectual property (IP) to indie’s advanced driver assistance system (ADAS) silicon and software portfolio.
Handset Vendor Market Share for 'Sixty' Countries - Q4 2023
Global handset shipments grew by 4.9% annually in Q4 2023. The "Sixty" countries tracked in this report accounted for 90% of the handset volumes in the quarter. Apple, Samsung and Xiaomi were the top three vendors by consolidated shipments to these markets.
Q1 2024 DRAM Market Report
This quarterly report provides a comprehensive analysis of the DRAM market, covering key aspects such as supply and demand dynamics across various segments including PC, datacenter, mobile, automotive, and more.
4Q 2023 Apple A-Series M-Series Processor Market Tracker
Apple's A-series and M-series applications processors (AP) revenue increased 4 percent year-on-year in Q4 2023 and a collective 8 percent year-on-year in 2023. Apple's A-series APs are used in iPhone, iPad, Apple TV, iPod Touch and HomePod while the M-series APs are used in iPad, MacBook, Macs and the Vision Pro devices. This report provides estimates of Apple's A-series and M-series shipments, revenues and ASPs by chip model from Q1 2010 to Q3 2024.
Deep Dive Teardown of the Samsung Galaxy S24 Ultra SM-S928U1 Smartphone
The Samsung S24 Ultra is powered by the Snapdragon 8 Gen 3, which is faster than the Snapdragon 8 Gen 2 found in the S23 Ultra. The S24 Ultra introduces a flat display, moving away from the curved edges of the S23 Ultra. It also uses a more durable Gorilla Glass Armor for protection.
Automotive in-Car Commerce 2024 Update
In-car commerce (also commonly called in-vehicle payments) is one of these more recent features that OEMs have been deploying over the last several years. In-car commerce enables vehicle occupants to pay for fuel, charging, parking, and other services from the infotainment system’s display. As of early 2024, 14 automotive brands offer in-car payment features in 15 countries, with more deployments planned.
Automotive Semiconductor Vendor 2023 Market Shares Data
This datasheet presents TechInsights analysis of 2023 automotive sector revenues and market shares of the leading semiconductor vendors, with revenue splits by major component product category and by region including N. America, Europe, Japan, China, South Korea and ROW. It also includes market shares and revenue splits for previous years extending back to 2010.
Sony IR Eye Tracking 1.8MP Camera from Apple Vision Pro Package Analysis
The Apple Vision Pro augmented reality headset uses four inferred cameras to track its wearer’s eyes. This report catalogues the structure of those camera modules, how they fit into the headset, and provides an overview of the Sony back-side illuminated CMOS image sensor that they house.
OmniVision OX03D4C 1/4" 3MP 2.1μm Pixel CMOS Image Sensor Device Essentials Plus
The OmniVision OX03D4C is a color, 3-megapixel (MP) resolution stacked back-illuminated (BI) CMOS image sensor (CIS) with a 1/4-inch optical format, LED flicker mitigation (LFM), and 140 dB high dynamic range (HDR) for automotive applications.
Baidu Kunlun II A2S1CAXGA SoC Packaging Quick Look Analysis
This is an Advanced Packaging Quick Look (APQ) summary document for the Baidu Kunlun Xin A2S1CAXGA processor, provided as a companion deliverable for the APQ-2312-801 project. The Baidu Kunlun Xin processor, also referred to as the Kunlun II, is the second-generation of the Baidu Kunlun processor series.
Survey Plus Teardown of the Xiaomi Redmi Note 13 23129RAA4G Smartphone
The Redmi Note 13 comes with a 120 Hz, 6.67-inch AMOLED touchscreen display offering a resolution of 1080 x 2400. Xiaomi Redmi Note 13 has four cameras.
Survey Plus Teardown of the Samsung Galaxy A15 SM-A155M Smartphone
Most of the main SoC in the Samsung Galaxy A15 4G are from Mediatek. In the comparison of the Samsung Galaxy A14 4G it has Octa-Core Helio G99 Applications/Baseband Processor (MT6789V-CD), Power Management (MT6366MW), and RF Transceiver (MT6186MV) chips.
Deep Dive Teardown of the Meridian Kia EV6 Audio Amplifier 96370-CV100 Automotive
The Meridian 96370-CV100 is a high-end audio 11 Cannel Amplifier that was designed Meridian Audio. This system is available in the KIA EV6. Communication between the audio amplifier and the audio elements in the car happens through one main connector.
Deep Dive Teardown of the Denso Toyota Prius Front Windshield Camera 8646C-47130 Automotive Camera
Designed by Denso, the Vision Sensor Camera is a part of the Toyota Prius safety and driver assistance system. It combines a millimeter-wave radar sensor and vision sensor to assist the driver in safely controlling the vehicle.
Deep Dive Teardown of the Xiaomi Redmi Note 13 Pro 2312CRAD3C Smartphone
Released in September 2023, the Xiaomi Redmi Note 13 has been equipped with Qualcomm’s Octa-Core Snapdragon 7s Gen 2 Applications/Baseband Processor # SM7435-100-AB, made in 4nm technology. Memory was provided by Micron and contains 12 GB Mobile LPDDR5 SDRAM and 512 GB 3D TLC NAND Flash.
STMicroelectronics Ouster L3 Chip Third-Generation Direct Time-of-Flight CMOS Image Sensor Device Essentials Plus
The Ouster OS1 Mid-Range High-Resolution Imaging LiDAR incorporates the new REV7 sensor that uses the L3 Digital LiDAR Chip. This L3 chip is a stacked back-illuminated (BI) direct time-of-flight (d-ToF) fabricated by STMicrolectronics. The L3 chip uses single photo avalanche diode (SPAD) pixels to analyze the IR signal that is returned to the LiDAR from the emitting source located in the LiDAR.
YMTC 1.33Tb 128L QLC 3D NAND Internal Waveform Overview
The following is an Internal Waveform Overview containing the program, read, and erase waveforms for the YMTC 1.33 Tb 128L quad-level-cell (QLC) 3D NAND flash memory device (die markings: CEC1A). This device is packaged inside the YMTC YMC4G0W1TbG1AA1C0 NAND flash memory package, which was found on the HikSemi HS-SSD-V300 2.5 inch SATA 6 Gb/s 512 GB solid state drive (SSD).
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