The top‑50 semiconductor suppliers accounted for 90% of the $559.1 billion global semiconductor market last year, an increase of four points from 86% in 2022.

The Qualcomm QTM565 antenna in package (AiP) is a 5th generation 5G mmWave antenna solution for mobile handsets. It features simultaneous transmit/receive front-end die and power management functions. The physical packaging of the QTM565 is similar to its predecessor the QTM545, with a central printed wiring board (PWB) hosting the dies and the antenna elements comprising separate laminate blocks.

Explore the 2024 electronics sales forecast, highlighting surges in IT infrastructure, server sales, and storage solutions. Gain insights into projected sectoral growth and market dynamics shaping the industry landscape for the year ahead.

Apple iPhone shipments declined 11% YoY to reach 49.2 million units and 17% market share slipping to second spot in global smartphone market in Q1 2024. One key reason for decline is slowdown in China given Huawei’s growth in the country as well as the restriction from Chinese government limiting use of iPhones by government officials. Moreover, not just China, iPhone shipments declined in most of the regions amid lengthening replacement cycle.

India smartphone market grew by 10% annually but declined by -11% sequentially in Q1 2024. A double-digit annual growth in the first quarter of 2024 itself augurs well for the whole year. Xiaomi, Vivo and Samsung were the top three smartphone vendors in the quarter.

The HG11-13972-2 RF transceiver die from the Qualcomm SDR875-004 RF transceiver was removed from the Samsung S24 Ultra 5G smartphone (SM-S928W).

Growth in the North American smartphone market declined in Q1 2024, the seventh quarter in a row of negative annualized growth for the region. Six of the Top-10 brands recorded negative annual shipment growth. Apple was the Number 1 smartphone vendor in the quarter by units shipped and Samsung led in Android.

The Broadcom BCM88920 StrataDNX™ Ramon3 is telecommunications industry switch gear packaged in a flip-chip ball grid array (FC-BGA) style package. It has a large footprint with over 9,000 package connections and a very low die-to-package ratio. This report presents detailed delayering of the organic substrate supporting the chip, as well as die photographs and analysis.

Several manufacturers share the design wins for the Huawei FreeClip wireless earbuds. The Bluetooth 5.3 SoC is supplied by WuQi. Maxscend provided BLE Voice Remote Control. ConvinientPower supplied the High Efficiency Wireless Power Receiver. SOUTHCHIP provided charging chips.

The Sony IR Eye Tracking Camera CMOS image sensor (CIS) was extracted from the Apple Vision Pro Headset (A2117). The Sony CIS is a 1.8 MP, monochrome, 1.5 μm, stacked back-illuminated (BI) electronic rolling shutter utilizing Exmor RS technology.